Patents by Inventor Brian E. O'Laughlin

Brian E. O'Laughlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8137597
    Abstract: A one-part, pressure activated chemiluminescent material is disclosed. The free-flowing powder is made by coating microcapsules, filled with a solvent and dye, with a powdered oxalate and a solid source for hydrogen peroxide. The reaction begins when the capsules are crushed, releasing the solvent, which dissolves the oxalate and the source for hydrogen peroxide. The resulting reaction transfers energy to the dye, which produces light.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: March 20, 2012
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Lawrence L. Brott, Brian E. O'Toole, Christopher A. Vaiana, Rajesh R. Naik
  • Publication number: 20100186151
    Abstract: Hockey-coaching helmet systems comprising protective headgear having a disguise element adapted to disguise the protective headgear as a baseball-style cap; the protective headgear is intended to be worn by coaches of athletic competitions, such as hockey coaches while maintaining required safety standards for hockey helmets.
    Type: Application
    Filed: January 21, 2010
    Publication date: July 29, 2010
    Inventor: Brian E. O'Leary
  • Patent number: 7618221
    Abstract: A corner protector and bulkhead protector for a cargo carrying vehicle such as a rail car are formed to have deep channels or corrugations that provide for both increased strength and rigidity while also providing support for load restraining web straps.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: November 17, 2009
    Assignee: Holland, L.P.
    Inventors: Stuart H. Thomson, Brian E. O'Neill
  • Patent number: 7366591
    Abstract: A method for performing performance prediction with respect to a vertical flight plan. A system performs performance prediction with respect to a vertical flight plan of an aircraft that includes determining which vertical flight plan rules of a plurality of vertical flight rules that have been loaded in a predictions processor are active by monitoring for criteria that are used to initiate or terminate one or more of the vertical flight plan rules. Aircraft state is predicted at waypoints along a lateral flight path in view of active vertical flight plan rules, and the predicted aircraft state is updated within an integrated flight plan database that stores prediction performance data associated with the aircraft's flight.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: April 29, 2008
    Assignee: Honeywell International, Inc.
    Inventors: Gary L. Hartmann, Michael R. Jackson, Brian E. O'Laughlin, Richard J. Snyder, Rosa N. Weber
  • Patent number: 7177785
    Abstract: The accuracy of flight management systems, based on mathematical prediction models calculated from aircraft specific data, are improved by adding engine sensor data to the calculations, checking sensor and pilot entered data, and comparing data measured from redundant sensors. A thrust estimate, calculated from available engine sensors, is added to the thrust-minus-drag aircraft model allowing prediction parameters to be accurately calculated even in a cruise condition. Sensor data and pilot entered data used in calculating predication parameters are checked to improve accuracy. Redundant sensor data is compared to determine the level of agreement. Redundant sensor data is also compared with a valid data range to find the sensor with the most accurate data.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: February 13, 2007
    Assignee: Honeywell International, Inc.
    Inventors: Gary L. Hartmann, Brian E. O'Laughlin, Stephen G. Pratt
  • Patent number: 6507782
    Abstract: The instant invention provides a system and method for controlling the flight of an aircraft to meet an RTA. The system comprises a speed profile generator that communicates with a trajectory generator to produce a speed profile signal that enables the aircraft to reach a waypoint substantially at a predetermined time. In the system of the instant invention, the speed profile generator receives a nominal speed command signal, a time error signal and a sensitivity signal. Based on these inputs, the speed profile generator produces a speed profile signal. The trajectory generator receives the speed profile signal and a required time of arrival signal. Based on these signals, the trajectory generator produces a time error signal and a sensitivity signal. This sensitivity signal represents the sensitivity of the time error signal to changes in the speed profile signal.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: January 14, 2003
    Assignee: Honeywell International Inc.
    Inventors: Jim R. Rumbo, Michael R. Jackson, Brian E. O'Laughlin
  • Patent number: 5315155
    Abstract: There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: May 24, 1994
    Assignee: Olin Corporation
    Inventors: Brian E. O'Donnelly, Brian Mravic, Jacob Crane, Deepak Mahulikar
  • Patent number: 4978052
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: December 18, 1990
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Satyam C. Cherukuri, Deepak Mahulikar, Brian E. O'Donnelly
  • Patent number: 4872047
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
    Type: Grant
    Filed: November 7, 1986
    Date of Patent: October 3, 1989
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Satyam C. Cherukuri, Deepak Mahulikar, Brian E. O'Donnelly
  • Patent number: 4735678
    Abstract: The present invention is directed to the process of forming a circuit pattern in a strip of metallic tape with an electrical discharge machining apparatus having an electrode and a pool of dielectric material. The electrode, having a negative image of the circuit pattern cut into a first end thereof, is submerged in the dielectric material. By controlling the pulsing of direct current across the gap between the electrode and the strip of metallic material for a period of time, a spark discharging across the gap causes small quantities of the metallic foil to be removed so as to cut the circuit pattern.
    Type: Grant
    Filed: April 13, 1987
    Date of Patent: April 5, 1988
    Assignee: Olin Corporation
    Inventors: Frank N. Mandigo, Brian E. O'Donnelly