Patents by Inventor Brian Eisenach

Brian Eisenach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
    Publication number: 20070020810
    Abstract: A process for mounting a wafer on a substrate includes applying a pre-applied die attach on a backside of the wafer with a composition having a thermoplastic portion and a thermoset portion. The composition has a predetermined cure temperature. The process further includes heating the wafer to a temperature sufficient to remove solvents from the thermoplastic portion of the composition below the cure temperature, mounting the wafer on the substrate, and heating the wafer and the substrate to a temperature above the cure temperature to cure the thermoset portion of the pre-applied die attach composition. A composition for performing the process is further disclosed.
    Type: Application
    Filed: June 16, 2006
    Publication date: January 25, 2007
    Applicant: Cookson Singapore Pte Ltd.
    Inventors: Brian Eisenach, Michael Previti, Mark Wilson, Avin Dhoble