Patents by Inventor Brian Eugene Parks

Brian Eugene Parks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacture integrated circuit package
    Patent number: 8697496
    Abstract: An integrated circuit package may be formed using a leadframe having an open space extending therethrough. A shunt is located within the open space such that it is not in contact with any portion of the leadframe. Tape may be applied to the lower surface of the leadframe to support the shunt and hold it in place relative to the leadframe until wirebonding and encapsulation have been completed. Thereafter, the tape may be removed.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: April 15, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Donald Charles Abbott, Ubol Annie Udompanyavit, Brian Eugene Parks
  • METHOD OF MANUFACTURE INTEGRATED CIRCUIT PACKAGE
    Publication number: 20140097527
    Abstract: An integrated circuit package may be formed using a leadframe having an open space extending therethrough. A shunt is located within the open space such that it is not in contact with any portion of the leadframe. Tape may be applied to the lower surface of the leadframe to support the shunt and hold it in place relative to the leadframe until wirebonding and encapsulation have been completed. Thereafter, the tape may be removed.
    Type: Application
    Filed: October 4, 2012
    Publication date: April 10, 2014
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Donald Charles Abbott, Ubol Annie Udompanyavit, Brian Eugene Parks