Patents by Inventor Brian F. Crossman

Brian F. Crossman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultra wideband BGA
    Patent number: 6933596
    Abstract: An electronic device packaging assembly (10) that includes a ball grid array (60) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly (10) includes a thin base plate (14) made of a suitable rigid material. Power vias (48), signal vias (26) and ground vias (46) are formed through the base plate (14) to be coupled to traces, circuit components, and/or the device (12) within the packaging assembly (10). An impedance matching compensation network (28) provides impedance matching between the device (12) and the signal vias (26). The ball grid array (60) includes a plurality of solder balls (68), including ground solder balls (72), signal solder balls (74) and power solder balls (76), electrically coupled to the appropriate via extending through the base plate (14).
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: August 23, 2005
    Assignee: Northrop Grumman Corporation
    Inventors: James A. Hathaway, Brian F. Crossman, Salah Din