Patents by Inventor Brian Fetzer

Brian Fetzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module with improved reliability
    Patent number: 10707858
    Abstract: A power module includes a first terminal, a second terminal, and a number of semiconductor die coupled between the first terminal and the second terminal. The semiconductor die are configured to provide a low-resistance path for current flow from the first terminal to the second terminal during a forward conduction mode of operation and a high-resistance path for current flow from the first terminal to the second terminal during a forward blocking configuration. Due to improvements made to the power module, it is able to pass a temperature, humidity, and bias test at 80% of its rated voltage for at least 1000 hours.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: July 7, 2020
    Assignee: Cree, Inc.
    Inventors: Mrinal K. Das, Adam Barkley, Brian Fetzer, Jonathan Young, Van Mieczkowski, Scott Allen
  • POWER MODULE WITH IMPROVED RELIABILITY
    Publication number: 20180331679
    Abstract: A power module includes a first terminal, a second terminal, and a number of semiconductor die coupled between the first terminal and the second terminal. The semiconductor die are configured to provide a low-resistance path for current flow from the first terminal to the second terminal during a forward conduction mode of operation and a high-resistance path for current flow from the first terminal to the second terminal during a forward blocking configuration. Due to improvements made to the power module, it is able to pass a temperature, humidity, and bias test at 80% of its rated voltage for at least 1000 hours.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 15, 2018
    Inventors: Mrinal K. Das, Adam Barkley, Brian Fetzer, Jonathan Young, Van Mieczkowski, Scott Allen
  • Power module with improved reliability
    Patent number: 9998109
    Abstract: A power module includes a first terminal, a second terminal, and a number of semiconductor die coupled between the first terminal and the second terminal. The semiconductor die are configured to provide a low-resistance path for current flow from the first terminal to the second terminal during a forward conduction mode of operation and a high-resistance path for current flow from the first terminal to the second terminal during a forward blocking configuration. Due to improvements made to the power module, it is able to pass a temperature, humidity, and bias test at 80% of its rated voltage for at least 1000 hours.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: June 12, 2018
    Assignee: Cree, Inc.
    Inventors: Mrinal K. Das, Adam Barkley, Brian Fetzer, Jonathan Young, Van Mieczkowski, Scott Allen