Abstract: A test cell (10) for containing equipment (12) subject to pressure testing comprises a plurality of metal plate wall panels (14) and a mesh roof panel (16) formed from mesh strands (26) of a high strength material. Each wall panel has a lapped connection (18) with an adjacent wall panel. The mesh panel (16) may be formed from a ballistic fabric, and the mesh strands (26) may be wire, rope and braid of steel, metal, plastic, natural or composite fiber, or a combination thereof. In the event of a pressure failure of the equipment (12) under test, the roof panel (16) captures fragments of the equipment while allowing the dissipation of pressure shock waves through the apertures (28) in the mesh. The lapped connections (18) between wall panels (14) result in increased friction between adjacent wall panels (14) and thus an increase in the strength of the connection when subject to pressure shock waves.

Abstract: A test cell (10) for containing equipment (12) subject to pressure testing comprises a plurality of metal plate wall panels (14) and a mesh roof panel (16) formed from mesh strands (26) of a high strength material. Each wall panel has a lapped connection (18) with an adjacent wall panel. The mesh panel (16) may be formed from a ballistic fabric, and the mesh strands (26) may be wire, rope and braid of steel, metal, plastic, natural or composite fibre, or a combination thereof. In the event of a pressure failure of the equipment (12) under test, the roof panel (16) captures fragments of the equipment while allowing the dissipation of pressure shock waves through the apertures (28) in the mesh. The lapped connections (18) between wall panels (14) result in increased friction between adjacent wall panels (14) and thus an increase in the strength of the connection when subject to pressure shock waves.

Abstract: A pivoting mount for a firearm used to attach a firearm accessory is provided. The pivot mount has a base configured to attach to the firearm, and a top pivotally connected to the base. The top of the pivoting mount is pivotable between an engaged and disengaged position.

Abstract: Selenium in the form of a reduced species such as selenocyanate is oxidized to produce an oxidized selenium species such as selenate or selenite, and then a biological reduction process is used to remove selenium from the oxidized selenium species. In an example, a chemical oxidant is added to a wastewater containing selenocyanate to produce selenate and selenite. The partially treated wastewater is then fed to a reactor containing a fixed media supporting a biofilm with selenium reducing organisms. The selenium in the selenate and selenite is reduced to an insoluble form of selenium, such as elemental selenium, which precipitates from the wastewater.

Abstract: In one embodiment, a grey water treatment system includes an oxidation reactor for oxidizing grey water. The grey water treatment system also includes a biological reduction and precipitation system with microbes designed to remove one or more target components from the oxidized grey water.

Abstract: An apparatus for coupling and decoupling clips is described. Specifically, the apparatus allows for installation of clips to building structures of varying elevations. The apparatus may comprise a telescoping pole, a lower pivot joint, an upper pivot joint, and at least one reversible clip. The reversible clip may be removed from the upper pivot joint by applying a substantially vertical force in a downward direction to the telescoping pole. Lights may be attached to the reversible clip. The lower pivot joint and upper pivot joint allow for the reversible clip to be coupled to building structures at various angles.

Abstract: In one embodiment, a grey water treatment system includes an oxidation reactor for oxidizing grey water. The grey water treatment system also includes a biological reduction and precipitation system with microbes designed to remove one or more target components from the oxidized grey water.

Abstract: An apparatus for coupling and decoupling clips is described. Specifically, the apparatus allows for installation of clips to building structures of varying elevations. The apparatus may comprise a telescoping pole, a lower pivot joint, an upper pivot joint, and at least one reversible clip. The reversible clip may be removed from the upper pivot joint by applying a substantially vertical force in a downward direction to the telescoping pole. Lights may be attached to the reversible clip. The lower pivot joint and upper pivot joint allow for the reversible clip to be coupled to building structures at various angles.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: An acoustic energy cleaning system and method which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer. In one embodiment, the invention includes combining a first frequency signal and a second frequency signal having a positive amplitude bias component so as to form a combined signal. The combined signal, which has a positive amplitude offset, is applied to a transducer system that converts the combined signal into acoustic waves. The acoustic waves can be applied to the object to be cleaned in a cleaning fluid.

Abstract: A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: An apparatus for connecting and anchoring tarpaulins, includes a polymer plastic elongate body having a first side, a second side, and a longitudinal axis. An integrally formed first connector and second connector extend parallel to the longitudinal axis for the entire length of the elongate body. The first connector has an opening facing the first side. The second connector has an opening facing the second side. Integrally formed anchoring wings underlie the elongate body, with a first side of each anchoring wing protruding past the sides of the elongate body. The second side of each of the anchoring wings merge into a vertical plane positioned along the longitudinal axis of the elongate body.

Abstract: A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.