Abstract: A loudspeaker assembly having a waveguide, comprising: a housing comprising an outer duct and a phase plug housing; a first driver comprising a diaphragm; a second driver coaxially disposed in front of the first driver diaphragm and comprising a capsule having a rear surface, wherein a curved passageway is formed around the capsule within a duct; and a phase plug disposed between the first driver diaphragm and the second driver, the phase plug positioned within the phase plug outer housing, and defining at least one slot having an inlet for providing air movement between the first driver diaphragm and the curved passageway; wherein the rear surface of the capsule forms part of the phase plug, and a uniform gap is defined between the first driver diaphragm and the rear surface of the capsule, and wherein the first driver is a lower frequency driver than the second driver.

Abstract: An apparatus for coupling and decoupling clips is described. Specifically, the apparatus allows for installation of clips to building structures of varying elevations. The apparatus may comprise a telescoping pole, a lower pivot joint, an upper pivot joint, and at least one reversible clip. The reversible clip may be removed from the upper pivot joint by applying a substantially vertical force in a downward direction to the telescoping pole. Lights may be attached to the reversible clip. The lower pivot joint and upper pivot joint allow for the reversible clip to be coupled to building structures at various angles.

Abstract: An apparatus for coupling and decoupling clips is described. Specifically, the apparatus allows for installation of clips to building structures of varying elevations. The apparatus may comprise a telescoping pole, a lower pivot joint, an upper pivot joint, and at least one reversible clip. The reversible clip may be removed from the upper pivot joint by applying a substantially vertical force in a downward direction to the telescoping pole. Lights may be attached to the reversible clip. The lower pivot joint and upper pivot joint allow for the reversible clip to be coupled to building structures at various angles.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: An acoustic energy cleaning system and method which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer. In one embodiment, the invention includes combining a first frequency signal and a second frequency signal having a positive amplitude bias component so as to form a combined signal. The combined signal, which has a positive amplitude offset, is applied to a transducer system that converts the combined signal into acoustic waves. The acoustic waves can be applied to the object to be cleaned in a cleaning fluid.

Abstract: A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: An apparatus for connecting and anchoring tarpaulins, includes a polymer plastic elongate body having a first side, a second side, and a longitudinal axis. An integrally formed first connector and second connector extend parallel to the longitudinal axis for the entire length of the elongate body. The first connector has an opening facing the first side. The second connector has an opening facing the second side. Integrally formed anchoring wings underlie the elongate body, with a first side of each anchoring wing protruding past the sides of the elongate body. The second side of each of the anchoring wings merge into a vertical plane positioned along the longitudinal axis of the elongate body.

Abstract: A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.