Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality a dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality a dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: The present disclosure provides a novel suspension device used in producing a composition, such as, but not limited to, a polyimide composition. The suspension device in its most general form comprises a support element and an attachment element. The attachment element is in communication at one of its ends with the support element and at the other with a workpiece, such as a poly(amic acid) or polyimide workpiece. The suspension device may further comprise additional elements. The suspension device maintains the workpiece in a suspended state during processing so as to reduce or eliminate processing-related defects.

Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.

Abstract: The present disclosure provides novel methods of producing a composition, such as, but not limited to, a polyimide composition. The methods in their most general form comprise providing a workpiece, suspending the workpiece and subjecting the suspended workpiece to processing such that the workpiece undergoes a transformation from a first state to a second state. By maintaining the workpiece in a suspended state during processing, processing-related defects are reduced or eliminated. Using such methods, the present disclosure provides compositions that are have no or reduced processing-related defects. In addition, the compositions are more consistent in chemical and physical properties and are cheaper and more economical to produce (since less product is rejected as unsuitable).

Abstract: The present disclosure provides novel methods of producing a composition, such as, but not limited to, a polyimide composition. The methods in their most general form comprise providing a workpiece, suspending the workpiece and subjecting the suspended workpiece to processing such that the workpiece undergoes a transformation from a first state to a second state. By maintaining the workpiece in a suspended state during processing, processing-related defects are reduced or eliminated. Using such methods, the present disclosure provides compositions that are have no or reduced processing-related defects. In addition, the compositions are more consistent in chemical and physical properties and are cheaper and more economical to produce (since less product is rejected as unsuitable).

Abstract: The present disclosure provides a novel suspension device used in producing a composition, such as, but not limited to, a polyimide composition. The suspension device in its most general form comprises a support element and an attachment element. The attachment element is in communication at one of its ends with the support element and at the other with a workpiece, such as a poly(amic acid) or polyimide workpiece. The suspension device may further comprise additional elements. The suspension device maintains the workpiece in a suspended state during processing so as to reduce or eliminate processing-related defects.