Patents by Inventor Brian G. Patrick
Brian G. Patrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10967616Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.Type: GrantFiled: March 18, 2013Date of Patent: April 6, 2021Assignee: NeXolve Holding Company, LLCInventors: James D. Moore, Brian G. Patrick, Brandon S. Farmer, Garrett D. Poe, David L. Rodman, Lonnie F. Bradburn, Jr., Amy S. Davis
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Patent number: 9962866Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality a dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.Type: GrantFiled: August 12, 2013Date of Patent: May 8, 2018Assignee: NeXolve CorporationInventors: James D. Moore, Brian G. Patrick, Brandon S. Farmer, Garrett D. Poe, David L. Rodman, Lonnie F. Bradburn, Amy S. Davis
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Publication number: 20130328235Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality a dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.Type: ApplicationFiled: August 12, 2013Publication date: December 12, 2013Applicant: Nexolve CorporationInventors: James D. Moore, Brian G. Patrick, Brandon S. Farmer, Garrett D. Poe, David L. Rodman, Lonnie F. Bradburn, JR., Amy S. Davis
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Publication number: 20130323480Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly containing the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the as layer can also include additives, as desired.Type: ApplicationFiled: March 18, 2013Publication date: December 5, 2013Applicant: NeXolve CorporationInventors: James D. Moore, Brian G. Patrick, Brandon S. Farmer, Garrett D. Poe, David L. Rodman, Lonnie F. Bradburn, JR., Amy S. Davis
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Patent number: 8506741Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.Type: GrantFiled: March 29, 2011Date of Patent: August 13, 2013Assignee: NeXolve CorporationInventors: James D. Moore, Brian G. Patrick, Brandon S. Farmer, Garrett D. Poe, David L. Rodman, Lonnie F. Bradburn, Jr., Amy S. Davis
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Patent number: 8342492Abstract: The present disclosure provides a novel suspension device used in producing a composition, such as, but not limited to, a polyimide composition. The suspension device in its most general form comprises a support element and an attachment element. The attachment element is in communication at one of its ends with the support element and at the other with a workpiece, such as a poly(amic acid) or polyimide workpiece. The suspension device may further comprise additional elements. The suspension device maintains the workpiece in a suspended state during processing so as to reduce or eliminate processing-related defects.Type: GrantFiled: August 24, 2007Date of Patent: January 1, 2013Assignee: Nexolve CorporationInventors: Garrett D. Poe, Brian G. Patrick
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Publication number: 20120251801Abstract: A protective film has a soluble polyimide polymer base layer and an exterior layer directly contacting the base layer exterior surface. The base layer is less than 12 microns thick, and is at least 2 meters long. The exterior layer includes at least one of a fluorinated polymer, a dielectric layer, one or more metallic layers, a metalloid layer, or a plurality of dielectric layers where each dielectric layer has a dielectric layer thickness that varies no more than 3%. The exterior layer or the base layer can also include additives, as desired.Type: ApplicationFiled: March 29, 2011Publication date: October 4, 2012Applicant: Nexolve CorporationInventors: James D. Moore, Brian G. Patrick, Brandon S. Farmer, Garrett D. Poe, David L. Rodman, Lonnie F. Bradburn, JR., Amy S. Davis
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Patent number: 7785517Abstract: The present disclosure provides novel methods of producing a composition, such as, but not limited to, a polyimide composition. The methods in their most general form comprise providing a workpiece, suspending the workpiece and subjecting the suspended workpiece to processing such that the workpiece undergoes a transformation from a first state to a second state. By maintaining the workpiece in a suspended state during processing, processing-related defects are reduced or eliminated. Using such methods, the present disclosure provides compositions that are have no or reduced processing-related defects. In addition, the compositions are more consistent in chemical and physical properties and are cheaper and more economical to produce (since less product is rejected as unsuitable).Type: GrantFiled: August 24, 2007Date of Patent: August 31, 2010Assignee: NeXolve CorporationInventors: Garrett D. Poe, Brian G. Patrick
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Publication number: 20090054615Abstract: The present disclosure provides novel methods of producing a composition, such as, but not limited to, a polyimide composition. The methods in their most general form comprise providing a workpiece, suspending the workpiece and subjecting the suspended workpiece to processing such that the workpiece undergoes a transformation from a first state to a second state. By maintaining the workpiece in a suspended state during processing, processing-related defects are reduced or eliminated. Using such methods, the present disclosure provides compositions that are have no or reduced processing-related defects. In addition, the compositions are more consistent in chemical and physical properties and are cheaper and more economical to produce (since less product is rejected as unsuitable).Type: ApplicationFiled: August 24, 2007Publication date: February 26, 2009Inventors: Garrett D. Poe, Brian G. Patrick
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Publication number: 20090050780Abstract: The present disclosure provides a novel suspension device used in producing a composition, such as, but not limited to, a polyimide composition. The suspension device in its most general form comprises a support element and an attachment element. The attachment element is in communication at one of its ends with the support element and at the other with a workpiece, such as a poly(amic acid) or polyimide workpiece. The suspension device may further comprise additional elements. The suspension device maintains the workpiece in a suspended state during processing so as to reduce or eliminate processing-related defects.Type: ApplicationFiled: August 24, 2007Publication date: February 26, 2009Inventors: Garrett D. Poe, Brian G. Patrick