Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.

Abstract: A loudspeaker configuration for a notebook computer includes one or more high frequency "upper" speakers and a low frequency "lower" speaker. The upper speakers are mounted within a display housing and emit sounds over a range including directional sounds having wavelengths less than one-third the upper speaker diameter. The "lower" speaker is mounted within a keyboard housing. The lower speaker is oriented downward onto the desktop or other support surface and displaces a larger volume of air than the upper speaker. Open space between a processor board and a lower housing base surface define an internal speaker-box chamber for the lower speaker. The housing base surface and a support surface for the computer defining an external speaker box for the lower speaker. The internal speaker box and external speaker box define a band pass acoustic filter for sound waves emitted from the second speaker. The sound waves passing through the band pass filter occur to a listener as non-directional sound.