Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: Disclosed herein are iMoD displays optimized by utilizing different materials for one or more different color subpixels. Such optimized displays have improved color gamut over displays where all subpixels are constructed with the same material. Also disclosed are methods for manufacturing such displays and methods for optimizing iMoD displays.

Abstract: Disclosed herein are methods and systems for testing the electrical characteristics of reflective displays, including interferometric modulator displays. In one embodiment, a controlled voltage is applied to conductive leads in the display and the resulting current is measured. The voltage may be controlled so as to ensure that interferometric modulators do not actuate during the resistance measurements. Also disclosed are methods for conditioning interferometric modulator display by applying a voltage waveform that causes actuation of interferometric modulators in the display.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: Disclosed herein are iMoD displays optimized by utilizing different materials for one or more different color subpixels. Such optimized displays have improved color gamut over displays where all subpixels are constructed with the same material. Also disclosed are methods for manufacturing such displays and methods for optimizing iMoD displays.

Abstract: Disclosed herein are methods and apparatus for testing interferometric modulators. The interferometric modulators may be tested by applying a time-varying voltage stimulus and measuring the resulting reflectivity from the modulators.

Abstract: Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device. In some embodiments, analysis of the process control monitors may utilize optical measurements.

Abstract: Disclosed herein are methods and systems for testing the electrical characteristics of reflective displays, including interferometric modulator displays. In one embodiment, a controlled voltage is applied to conductive leads in the display and the resulting current is measured. The voltage may be controlled so as to ensure that interferometric modulators do not actuate during the resistance measurements. Also disclosed are methods for conditioning interferometric modulator display by applying a voltage waveform that causes actuation of interferometric modulators in the display.

Abstract: Disclosed herein are iMoD displays optimized by utilizing different materials for one or more different color subpixels. Such optimized displays have improved color gamut over displays where all subpixels are constructed with the same material. Also disclosed are methods for manufacturing such displays and methods for optimizing iMoD displays.

Abstract: An optical isolation structure is incorporated into a display between the display elements and the transparent substrate for the display elements. The optical isolation structure reflects light rays within the substrate that impact the structure at high angles relative to normal to the structure, thereby permitting the substrate to be used as an integrated light guide for distributing light over the display from a light source on the edge of the substrate. The optical isolation structure may include a single layer having an index of refraction less than the substrate or a plurality of thin-film interference layers.

Abstract: An optical isolation structure is incorporated into a display between the display elements and the transparent substrate for the display elements. The optical isolation structure reflects light rays within the substrate that impact the structure at high angles relative to normal to the structure, thereby permitting the substrate to be used as an integrated light guide for distributing light over the display from a light source on the edge of the substrate. The optical isolation structure may include a single layer having an index of refraction less than the substrate or a plurality of thin-film interference layers.

Abstract: Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device. In some embodiments, analysis of the process control monitors may utilize optical measurements.

Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.