Patents by Inventor Brian George Reid Ottey

Brian George Reid Ottey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Robust interconnect structure
    Patent number: 6133136
    Abstract: A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.
    Type: Grant
    Filed: May 19, 1999
    Date of Patent: October 17, 2000
    Assignee: International Business Machines Corporation
    Inventors: Daniel Charles Edelstein, Vincent McGahay, Henry A. Nye, III, Brian George Reid Ottey, William H. Price