Patents by Inventor Brian Gulliver
Brian Gulliver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8371134Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: June 30, 2009Date of Patent: February 12, 2013Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 8024942Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: December 21, 2007Date of Patent: September 27, 2011Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 7942642Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: June 30, 2009Date of Patent: May 17, 2011Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Publication number: 20100293993Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: December 21, 2007Publication date: November 25, 2010Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Publication number: 20100071389Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: June 30, 2009Publication date: March 25, 2010Applicant: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Publication number: 20100071390Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: June 30, 2009Publication date: March 25, 2010Applicant: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 7318325Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: January 31, 2006Date of Patent: January 15, 2008Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Publication number: 20060150666Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: January 31, 2006Publication date: July 13, 2006Inventors: Daniel Rini, Louis Chow, H. Anderson, Jayanta Kapat, Bradley Carman, Brian Gulliver, Jose Recio
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Patent number: 7010936Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: July 22, 2003Date of Patent: March 14, 2006Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Publication number: 20040129018Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: July 22, 2003Publication date: July 8, 2004Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio