Patents by Inventor Brian Gulliver

Brian Gulliver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8371134
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: February 12, 2013
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 8024942
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: September 27, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7942642
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: May 17, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20100293993
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: December 21, 2007
    Publication date: November 25, 2010
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20100071389
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: June 30, 2009
    Publication date: March 25, 2010
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20100071390
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: June 30, 2009
    Publication date: March 25, 2010
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7318325
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: January 15, 2008
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20060150666
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: January 31, 2006
    Publication date: July 13, 2006
    Inventors: Daniel Rini, Louis Chow, H. Anderson, Jayanta Kapat, Bradley Carman, Brian Gulliver, Jose Recio
  • Patent number: 7010936
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: March 14, 2006
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20040129018
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: July 22, 2003
    Publication date: July 8, 2004
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio