Patents by Inventor Brian H. Christensen

Brian H. Christensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Digital and RF system and method therefor
    Patent number: 7479407
    Abstract: A stacked die system (10) has a first die (16) having a first surface with active circuitry, a second die (18) having a first surface with active circuitry, and a conductive shield (28) interposed between the first surface of the first die and the first surface of the second die. In one embodiment, the distance between the first surfaces of the first and second die is less than one millimeter. The stacked die system may also include a package substrate (12) where the active circuitry of the first and second die are electrically connected to the package substrate. The electrical connections may be formed using wire bonds (56, 58, 60, 62). Alternatively, the first die may be connected to the package substrate in a flip chip configuration. In one embodiment, the active circuitry of the first die generates RF signals where the shield helps protect the RF signals from interference caused by the active circuitry of the second die.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: January 20, 2009
    Assignee: Freescale Semiconductor, Inc.
    Inventors: John Gehman, Brian H. Christensen, James H. Kleffner, Addi B. Mistry, David Patten, John Rohde, Daryl Wilde
  • Digital and RF system and method therefor
    Publication number: 20040195591
    Abstract: A stacked die system (10) has a first die (16) having a first surface with active circuitry, a second die (18) having a first surface with active circuitry, and a conductive shield (28) interposed between the first surface of the first die and the first surface of the second die. In one embodiment, the distance between the first surfaces of the first and second die is less than one millimeter. The stacked die system may also include a package substrate (12) where the active circuitry of the first and second die are electrically connected to the package substrate. The electrical connections may be formed using wire bonds (56, 58, 60, 62). Alternatively, the first die may be connected to the package substrate in a flip chip configuration. In one embodiment, the active circuitry of the first die generates RF signals where the shield helps protect the RF signals from interference caused by the active circuitry of the second die.
    Type: Application
    Filed: November 22, 2002
    Publication date: October 7, 2004
    Inventors: John Gehman, Brian H. Christensen, James H. Kleffner, Addi B. Mistry, David Patten, John Rohde, Daryl Wilde