Abstract: In an embodiment, a charge pump of relatively simple design is provided which can generate sufficient drive voltage for a power switching device from a low-supply-voltage (e.g., 1V). In some embodiments, this charge pump performs better at lower input voltages when there are loading conditions (i.e., when the charge-pump output powers other circuit blocks such as amplifiers and LDO's).

Abstract: In one embodiment, an integrated circuit is provided for detecting when a temperature reaches a specified value. The circuit includes a differential circuit block having first and second transistors. A control terminal of the first transistor is coupled to a first voltage source, and a control terminal of the second transistor is coupled to a second voltage source. The second transistor has an area larger than the first transistor. The differential circuit block compares a first current flowing into the first transistor and a second current flowing into the second transistor. The differential circuit block outputs a signal to indicate that the specified temperature has been reached when the first current equals the second current according to specified values of the first voltage source, the second voltage source, and the ratio of the areas of the first and second transistors. A single-ended circuit block amplifies the output signal of the differential circuit block to a predetermined amplitude.

Abstract: In one embodiment, a charge pump system includes an input terminal at which an input voltage is received, and an output terminal at which at an output voltage is provided. N stages are connected in cascade between the input terminal and the output terminal. Each of the N stages includes at most one inverter circuit, the inverter circuit having a first transistor connected at a node to a second transistor. A first capacitor is coupled at one end to the node between the first and second transistors, and is coupled at another end to receive one of two non-overlapping phase signals. In each stage, at one value for the one of two non-overlapping phase signals, the first capacitor of the stage is charged by a respective stage input voltage, and at another value for the one of two non-overlapping phase signals the first capacitor of the stage is discharged to provide a respective stage output voltage.

Abstract: In one embodiment, an integrated circuit is provided for detecting when a temperature reaches a specified value. The circuit includes a differential circuit block having first and second transistors. A control terminal of the first transistor is coupled to a first voltage source, and a control terminal of the second transistor is coupled to a second voltage source. The second transistor has an area larger than the first transistor. The differential circuit block compares a first current flowing into the first transistor and a second current flowing into the second transistor. The differential circuit block outputs a signal to indicate that the specified temperature has been reached when the first current equals the second current according to specified values of the first voltage source, the second voltage source, and the ratio of the areas of the first and second transistors. A single-ended circuit block amplifies the output signal of the differential circuit block to a predetermined amplitude.

Abstract: A trenched field effect transistor suitable especially for low voltage power applications provides low leakage blocking capability due to a gate controlled barrier region between the source region and drain region. Forward conduction occurs through an inversion region between the source region and drain region. Blocking is achieved by a gate controlled depletion barrier. Located between the source and drain regions is a fairly lightly doped body region. The gate electrode, located in a trench, extends through the source and body regions and in some cases into the upper portion of the drain region. The dopant type of the polysilicon gate electrode is the same type as that of the body region. The body region is a relatively thin and lightly doped epitaxial layer grown upon a highly doped low resistivity substrate of opposite conductivity type. In the blocking state the epitaxial body region is depleted due to applied drain-source voltage, hence a punch-through type condition occurs vertically.

Abstract: A trenched field effect transistor suitable especially for low voltage power applications provides low leakage blocking capability due to a gate controlled barrier region between the source region and drain region. Forward conduction occurs through an inversion region between the source region and drain region. Blocking is achieved by a gate controlled depletion barrier. Located between the source and drain regions is a fairly lightly doped body region. The gate electrode, located in a trench, extends through the source and body regions and in some cases into the upper portion of the drain region. The dopant type of the polysilicon gate electrode is the same type as that of the body region. The body region is a relatively thin and lightly doped epitaxial layer grown upon a highly doped low resistivity substrate of opposite conductivity type. In the blocking state the epitaxial body region is depleted due to applied drain-source voltage, hence a punch-through type condition occurs vertically.

Abstract: A current-limit circuit and a method of limiting current supplied to a load through a power transistor utilize a control transistor that is selectively activated to a conducting state to limit the current conducted through the power transistor in response to a predefined condition. The predefined condition may be a short-circuit condition or an over-current condition. The configuration and operation of the control transistor are such that, when the control transistor is in a conducting state, the current conducted through the power transistor is limited by the structural ratio of the two transistors. However, during normal operating conditions when the control transistor is deactivated to a non-conducting state, the control transistor does not degrade the performance of the power transistor. In a first embodiment, the current-limit circuit is configured to provide protection from a short-circuit condition.

Abstract: A circuit and a method for comparing an input voltage to an internally generated reference voltage utilize a bias network to make the voltage comparison. The bias network is preferably configured to generate a proportional-to-absolute-temperature (PTAT) reference voltage, which is used for the voltage comparison. Although the circuit can be implemented to operate in a number of applications, the circuit is particularly useful in a current sensing application. The circuit includes the bias network, a comparison current path and an output terminal. The comparison current path is configured to partially duplicate a current path of the bias network on which the reference voltage is generated. The comparison current path includes a current control element and an active transistor. Depending on the input voltage applied to the active transistor of the comparison current path, the output terminal is driven to generate either a high or a low comparison signal.

Abstract: In the present method, a semiconductor substrate is provided with an epitaxial layer thereon. A source/drain region is provided in a portion of the epitaxial layer, and a plurality of trenches are etched in the epitaxial layer and extend into the substrate, to define a plurality of mesas.An oxide layer of generally uniform thickness is provided over the mesas and in the trenches, and a polysilicon layer is provided over the oxide layer and is etched so that the oxide layer overlying the mesas is exposed, and the top surface of the polysilicon within the trenches is below the level of the tops of the mesas.A layer of spin-on-glass (SOG) is provided, and the SOG layer and oxide layer are etched substantially to the level of the tops of the mesas, to expose the tops of the mesas and to leave the portions of the SOG over the respective polysilicon portions in the trenches substantially coplaner with the tops of the mesas.

Abstract: A trenched field effect transistor suitable especially for low voltage power applications provides low leakage blocking capability due to a gate controlled barrier region between the source region and drain region. Forward conduction occurs through an inversion region between the source region and drain region. Blocking is achieved by a gate controlled depletion barrier. Located between the source and drain regions is a fairly lightly doped body region. The gate electrode, located in a trench, extends through the source and body regions and in some cases into the upper portion of the drain region. The dopant type of the polysilicon gate electrode is the same type as that of the body region. The body region is a relatively thin and lightly doped epitaxial layer grown upon a highly doped low resistivity substrate of opposite conductivity type. In the blocking state the epitaxial body region is depleted due to applied drain-source voltage, hence a punch-through type condition occurs vertically.

Abstract: A trenched-gate power MOSFET includes a body region that is formed within a mesa between adjacent gate trenches. The doping concentration of the body region is established such that the body region does not fully deplete at normal drain voltages. The MOSFET also includes a gate which is doped with material of a conductivity type opposite to that of the body. The width of the mesa and the doping concentration of the body region and gate are established such that the body region is fully depleted by the combined effects of the source-body and drain body junctions and the gate. As a result, the conventional source-body short can be eliminated, providing a greater cell packing density and lower on-resistance while maintaining acceptable levels of leakage current when the MOSFET is in the off-state.

Abstract: A trenched DMOS transistor overcomes the problem of a parasitic JFET at the trench bottom (caused by deep body regions extending deeper than the trench) by providing a doped trench bottom implant region at the bottom of the trench and extending into the surrounding drift region. This trench bottom implant region has the same doping type, but is more highly doped, than the surrounding drift region. The trench bottom implant region significantly reduces the parasitic JFET resistance by optimizing the trench bottom implant dose, without creating reliability problems.

Abstract: A trenched MOSFET in its on-state conducts current through an accumulation region and through an inverted depletion barrier layer located along the trench sidewalls. Blocking is achieved by gate control depletion of the adjacent region and by the depletion barrier layer (having the appearance of "ears" in a cross sectional view and being of opposite doping type to the adjacent region) which extends laterally from the trench sidewalls into the drift region. This MOSFET has superior on-state specific resistance to that of prior art trenched MOSFETs and also has good performance in terms of on state resistance, while having superior blocking characteristics to those of prior art trenched MOSFETs. The improvement in the blocking characteristic is provided by the depletion barrier layer which is a semiconductor doped region. In the blocking state, the depletion barrier layer is fully or almost fully depleted to prevent parasitic bipolar conduction.

Abstract: A trenched field effect transistor suitable especially for low voltage power applications provides low leakage blocking capability due to a gate controlled barrier region between the source region and drain region. Forward conduction occurs through an inversion region between the source region and drain region. Blocking is achieved by a gate controlled depletion barrier. Located between the source and drain regions is a fairly lightly doped body region. The gate electrode, located in a trench, extends through the source and body regions and in some cases into the upper portion of the drain region. The dopant type of the polysilicon gate electrode is the same type as that of the body region. The body region is a relatively thin and lightly doped epitaxial layer grown upon a highly doped low resistivity substrate of opposite conductivity type. In the blocking state the epitaxial body region is depleted due to applied drain-source voltage, hence a punch-through type condition occurs vertically.