Patents by Inventor Brian Haas
Brian Haas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240117374Abstract: Pesticidal proteins are provided that combine two or more modes of action into a single molecule. These pesticidal proteins therefor exhibit greater efficacy and/or durability of resistance, for the purposes of pest control, and can be utilized for pest control by provision in the diet of a pest organism, or by topical application to crop plants and/or pests. Methods and compositions for producing and using such proteins are also provided.Type: ApplicationFiled: October 30, 2023Publication date: April 11, 2024Inventors: Timothy K. Ball, Artem G. Evdokimov, Larry A. Gilbertson, Victor M. Guzov, Jeffrey A. Haas, Qing Huai, Sergey Ivashuta, Melissa M. Kemp, Yifei Kong, Thomas M. Malvar, Byron V. Olsen, Parthasarathy Ramaseshadri, Brian E. Weiner
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Patent number: 8068234Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.Type: GrantFiled: February 18, 2009Date of Patent: November 29, 2011Assignee: KLA-Tencor CorporationInventors: Shouhong Tang, George Kren, Dieter Mueller, Brian Haas, Daniel Kavaldjiev
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Publication number: 20100208272Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.Type: ApplicationFiled: February 18, 2009Publication date: August 19, 2010Applicant: KLA-Tencor CorporationInventors: Shouhong Tang, George Kren, Dieter Mueller, Brian Haas, Daniel Kavaldjiev
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Publication number: 20080090309Abstract: A method for rapid thermal annealing is disclosed. As the substrate is inserted into an annealing chamber, it begins to heat due to the heat radiating from chamber components that were heated when a previous substrate was annealed. Thus, the leading edge of the substrate may be at an elevated temperature while the trailing edge of the substrate may be at room temperature while the substrate is inserted causing a temperature gradient is present across the substrate. Once the substrate is completely inserted into the annealing chamber, the temperature gradient may still be present. By compensating for the temperature gradient across the substrate, the substrate may be annealed uniformly.Type: ApplicationFiled: May 20, 2007Publication date: April 17, 2008Inventors: JOSEPH RANISH, Balasubramanian Ramachandran, Ravi Jallepally, Sundar Ramamurthy, Vedapuram Achutharaman, Brian Haas, Aaron Hunter, Wolfgang Aderhold
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Publication number: 20070229809Abstract: Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.Type: ApplicationFiled: April 4, 2006Publication date: October 4, 2007Applicant: KLA-Tencor Technologies Corp.Inventors: Alexander Belyaev, Daniel Kavaldjiev, Amith Murali, Aleksey Petrenko, Mike Kirk, David Shortt, Brian Haas, Kurt Haller
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Patent number: 7127367Abstract: Method and apparatus for obtaining a tailored heat transfer profile in a chamber housing a microprocessor manufacturing process, including estimating heat transfer properties of the chamber; estimating heat absorptive properties of a wafer; adjusting the physical characteristics of the chamber to correct the heat transfer properties; and utilizing the chamber for manufacturing microprocessors.Type: GrantFiled: September 24, 2004Date of Patent: October 24, 2006Assignee: Applied Materials, Inc.Inventors: Balasubramanian Ramachandran, Joseph Michael Ranish, Ravi Jallepally, Sundar Ramamurthy, Raman Achutharaman, Brian Haas, Aaron Hunter
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Patent number: 7041931Abstract: In a system for thermal processing of a semiconductor substrate, a reflector plate has a stepped surface facing the substrate during heating and cooling of the substrate. The raised surface of the reflector plate has reduced reflectivity, providing advantages during, among other things, cooling of the substrate. The reflector plate also includes a number of recesses to which one or more pyrometers are coupled. These recesses have a highly reflective surface, providing advantages in the performance of the pyrometers.Type: GrantFiled: October 24, 2002Date of Patent: May 9, 2006Assignee: Applied Materials, Inc.Inventors: Dean Jennings, Joseph M. Ranish, Brian Haas, Ajit Balakrishna, Sundar Ramamurthy, Aaron Hunter, Mark Yam
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Publication number: 20050102108Abstract: Method and apparatus for obtaining a tailored heat transfer profile in a chamber housing a microprocessor manufacturing process, including estimating heat transfer properties of the chamber; estimating heat absorptive properties of a wafer; adjusting the physical characteristics of the chamber to correct the heat transfer properties; and utilizing the chamber for manufacturing microprocessors.Type: ApplicationFiled: September 24, 2004Publication date: May 12, 2005Inventors: Balasubramanian Ramachandran, Joseph Ranish, Ravi Jallepally, Sundar Ramamurthy, Raman Achutharaman, Brian Haas, Aaron Hunter
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Publication number: 20040079746Abstract: In a system for thermal processing of a semiconductor substrate, a reflector plate has a stepped surface facing the substrate during heating and cooling of the substrate. The raised surface of the reflector plate has reduced reflectivity, providing advantages during, among other things, cooling of the substrate. The reflector plate also includes a number of recesses to which one or more pyrometers are coupled. These recesses have a highly reflective surface, providing advantages in the performance of the pyrometers.Type: ApplicationFiled: October 24, 2002Publication date: April 29, 2004Applicant: Applied Materials, Inc.Inventors: Dean Jennings, Joseph M. Ranish, Brian Haas, Ajit Balakrishna, Sundar Ramamurthy, Aaron Hunter, Mark Yam
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Publication number: 20040058560Abstract: A method for thermally processing a semiconductor substrate comprises: heating the substrate to a target peak temperature while controlling the gas pressure in the processing chamber at a pressure level that is significantly lower than atmospheric pressure; providing a flow of a purge gas between the substrate and a thermal reservoir at or near the time the substrate temperature reaches the target peak temperature while adjusting the gas pressure in the processing chamber to a second pressure level. Preferably, the purge gas has a relatively high thermal conductivity.Type: ApplicationFiled: September 20, 2002Publication date: March 25, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Joseph Ranish, Dean Jennings, Brian Haas
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Publication number: 20040049285Abstract: An orthopaedic implant system has an orthopaedic component with a stem for receipt in a bone. The stem has a rough outer surface to provide a bonding surface for cement or to provide a substrate for bony ingrowth for fixing the implant in the bone. The system also includes a sleeve for use with the stem of the orthopaedic component. The surgeon can opt to use the orthopaedic component alone without any sleeve or can use the orthopaedic component with a sleeve if the patient's condition warrants.Type: ApplicationFiled: August 15, 2003Publication date: March 11, 2004Inventor: Brian Haas
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Patent number: 6133152Abstract: An apparatus to isolate a rotating frame in a processing chamber, comprising: a support cylinder rotatably extending from the rotating frame; and a co-rotating edge ring extension extending from the support cylinder to at least one of substantially thermally, optically and mechanically isolate the region above the co-rotating edge ring extension from the region below the co-rotating edge ring extension.Type: GrantFiled: May 16, 1997Date of Patent: October 17, 2000Assignee: Applied Materials, Inc.Inventors: Benjamin Bierman, Meredith J. Williams, David S. Ballance, Brian Haas, Paul Deaton, James V. Tietz
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Patent number: 6123766Abstract: A method for controlling the temperature of a substrate in a processing chamber. The processing chamber employs a heating control over at least two heating zones. Each heating zone is independently controllable according to a measured signal corresponding to the substrate temperature and a user-definable offset.Type: GrantFiled: May 16, 1997Date of Patent: September 26, 2000Assignee: Applied Materials, Inc.Inventors: Meredith J. Williams, David S. Ballance, Benjamin Bierman, Paul Deaton, Brian Haas, Nobuyuki Takahashi, James V. Tietz
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Patent number: 6035100Abstract: In one embodiment, the invention is directed to an apparatus for preventing depositions from occurring on a reflector in a processing chamber, comprising: a cover disposed adjacent to the reflector, the cover optically transparent over a range of wavelengths in which the reflector is reflective; and at least one cover support for maintaining the position of the cover relative to the reflector.Type: GrantFiled: May 16, 1997Date of Patent: March 7, 2000Assignee: Applied Materials, Inc.Inventors: Benjamin Bierman, David S. Ballance, James V. Tietz, Brian Haas, Meredith J. Williams, Paul Deaton
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Patent number: 5960555Abstract: An apparatus for purging the backside of a substrate in a process chamber includes a purge gas injector. The injector includes a substantially annular-shaped opening providing a slit that is structured and arranged to direct a flow of purge gas about radially outward therefrom in a direction approximately parallel to a plane defined by the substrate, wherein the substrate is supported in the process chamber above the purge gas injector. When the substrate is rotated at a sufficient speed, the purge gas flowing from the injector is impelled to flow spirally outward along the backside of the substrate.Type: GrantFiled: May 16, 1997Date of Patent: October 5, 1999Assignee: Applied Materials, Inc.Inventors: Paul Deaton, Benjamin Bierman, Meredith J. Williams, Brian Haas, David S. Ballance, James V. Tietz
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Patent number: 5920797Abstract: A method of reducing stress on a substrate in a thermal processing chamber. The method includes the steps of supporting a first portion of a substrate by means of contacting the same such that a second portion of the substrate is not contacted, part of the second portion forming one wall of a cavity, and flowing a gas into the cavity such that the pressure of the gas exerts a force on the second portion to at least partially support the second portion.Type: GrantFiled: December 3, 1996Date of Patent: July 6, 1999Assignee: Applied Materials, Inc.Inventors: David S. Ballance, Benjamin Bierman, James V. Tietz, Brian Haas