Patents by Inventor Brian Head

Brian Head has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic post exposure bake apparatus and method
    Patent number: 8288174
    Abstract: An Electrostatic Post Exposure Bake (EPEB) subsystem comprising an Electrostatic Bake Plate (EBP) configured in a processing chamber in an EPEB subsystem, wherein the EPEB wafer comprises an exposed masking layer having unexposed regions and exposed regions therein and the EPEB wafer is developed using the EBP.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: October 16, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Benjamen M. Rathsack, Brian Head, Steven Scheer
  • ELECTROSTATIC POST EXPOSURE BAKE APPARATUS AND METHOD
    Publication number: 20120244645
    Abstract: An Electrostatic Post Exposure Bake (EPEB) subsystem comprising an Electrostatic Bake Plate (EBP) configured in a processing chamber in an EPEB subsystem, wherein the EPEB wafer comprises an exposed masking layer having unexposed regions and exposed regions therein and the EPEB wafer is developed using the EBP.
    Type: Application
    Filed: March 24, 2011
    Publication date: September 27, 2012
    Applicant: Tokyo Electron Limited
    Inventors: Benjamen M. Rathsack, Brian Head, Steven Scheer
  • Heat treatment apparatus and methods for thermally processing a substrate using a pressurized gaseous environment
    Patent number: 7665917
    Abstract: Apparatus and methods for heating a substrate in a pressurized environment inside of a thermal processing system. The substrate is placed in a gaseous environment inside a processing chamber of the thermal processing system. The substrate is supported in the gaseous environment. The gas pressure inside the processing chamber is increased above atmospheric pressure, which increases the temperature of the gaseous environment. Heat is transferred from the pressurized gaseous environment to the substrate for thermally processing a layer on the substrate.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: February 23, 2010
    Assignee: Tokyo Electron Limited
    Inventor: Brian Head
  • HEAT TREATMENT APPARATUS AND METHODS FOR THERMALLY PROCESSING A SUBSTRATE USING A PRESSURIZED GASEOUS ENVIRONMENT
    Publication number: 20080239259
    Abstract: Apparatus and methods for heating a substrate in a pressurized environment inside of a thermal processing system. The substrate is placed in a gaseous environment inside a processing chamber of the thermal processing system. The substrate is supported in the gaseous environment. The gas pressure inside the processing chamber is increased above atmospheric pressure, which increases the temperature of the gaseous environment. Heat is transferred from the pressurized gaseous environment to the substrate for thermally processing a layer on the substrate.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 2, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Brian Head