Patents by Inventor Brian Helenbrook

Brian Helenbrook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Removing a sheet from the surface of a melt using elasticity and buoyancy
    Patent number: 8764901
    Abstract: Embodiments related to sheet production are disclosed. A melt of a material is cooled to form a sheet of the material on the melt. The sheet is formed in a first region at a first sheet height. The sheet is translated to a second region such that it has a second sheet height higher than the first sheet height. The sheet is then separated from the melt. A seed wafer may be used to form the sheet.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: July 1, 2014
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Peter L. Kellerman, Dawei Sun, Brian Helenbrook, David S. Harvey
  • REMOVING A SHEET FROM THE SURFACE OF A MELT USING ELASTICITY AND BUOYANCY
    Publication number: 20110272115
    Abstract: Embodiments related to sheet production are disclosed. A melt of a material is cooled to form a sheet of the material on the melt. The sheet is formed in a first region at a first sheet height. The sheet is translated to a second region such that it has a second sheet height higher than the first sheet height. The sheet is then separated from the melt. A seed wafer may be used to form the sheet.
    Type: Application
    Filed: March 3, 2011
    Publication date: November 10, 2011
    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventors: Peter L. Kellerman, Dawei Sun, Brian Helenbrook, David S. Harvey