Abstract: An apparatus and method for separating a nonmetallic substrate is disclosed as including a first beam; a first quenching device positioned so that a coolant stream may be applied to the substrate at or immediately adjacent to the trailing end of the first spot; a second beam; and a second quenching device positioned between the first quenching device and the second beam. At least one of an angle at which the first scribe beam impinges on the substrate and an energy intensity of the first scribe beam impinging on the substrate are adjusted to obtain right angle separation. A crack sensor and controller can also be provided for measuring a position of the cut line, comparing the position with a reference position and adjusting the power intensity of the second beam based on the comparison of the position of the cut line with the reference position.

Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.

Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.

Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.