Patents by Inventor Brian Howard Calhoun
Brian Howard Calhoun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10888040Abstract: The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.Type: GrantFiled: August 28, 2018Date of Patent: January 5, 2021Assignee: Qorvo US, Inc.Inventors: David Jandzinski, Thomas Scott Morris, Brian Howard Calhoun
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Patent number: 10856456Abstract: The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.Type: GrantFiled: August 28, 2018Date of Patent: December 1, 2020Assignee: Qorvo US, Inc.Inventors: David Jandzinski, Thomas Scott Morris, Brian Howard Calhoun
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Publication number: 20190104653Abstract: The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.Type: ApplicationFiled: August 28, 2018Publication date: April 4, 2019Inventors: David Jandzinski, Thomas Scott Morris, Brian Howard Calhoun
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Patent number: 9627230Abstract: Shielded electronic packages may have metallic lead frames to connect an electromagnetic shield to ground. In one embodiment, a metallic lead frame of the electronic package and a surface of the metallic lead frame defines a component area for attaching an electronic component. The metallic lead frame includes a metallic structure associated with the component area that may have a grounding element for connecting to ground and one or more signal connection elements, such as signal leads, for transmitting input and output signals. The electromagnetic shield connects to the metallic lead frame to safely connect to ground while maintaining the signal connection elements isolated from the shield.Type: GrantFiled: February 28, 2011Date of Patent: April 18, 2017Assignee: Qorvo US, Inc.Inventors: Dan Carey, Brian Howard Calhoun
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Patent number: 9576823Abstract: Shielded electronic packages may have metallic lead frames to connect an electromagnetic shield to ground. In one embodiment, a metallic lead frame of the electronic package and a surface of the metallic lead frame defines a component area for attaching an electronic component. The metallic lead frame includes a metallic structure associated with the component area that may have a grounding element for connecting to ground and one or more signal connection elements, such as signal leads, for transmitting input and output signals. The electromagnetic shield connects to the metallic lead frame to safely connect to ground while maintaining the signal connection elements isolated from the shield.Type: GrantFiled: February 28, 2011Date of Patent: February 21, 2017Assignee: Qorvo US, Inc.Inventors: Dan Carey, Brian Howard Calhoun
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Patent number: 8296941Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: May 27, 2011Date of Patent: October 30, 2012Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20120218729Abstract: Shielded electronic packages may have metallic lead frames to connect an electromagnetic shield to ground. In one embodiment, a metallic lead frame of the electronic package and a surface of the metallic lead frame defines a component area for attaching an electronic component. The metallic lead frame includes a metallic structure associated with the component area that may have a grounding element for connecting to ground and one or more signal connection elements, such as signal leads, for transmitting input and output signals. The electromagnetic shield connects to the metallic lead frame to safely connect to ground while maintaining the signal connection elements isolated from the shield.Type: ApplicationFiled: February 28, 2011Publication date: August 30, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Dan Carey, Brian Howard Calhoun
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Publication number: 20110225803Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20100199492Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: April 23, 2010Publication date: August 12, 2010Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
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Publication number: 20090000815Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen