Patents by Inventor Brian Hubert

Brian Hubert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110297084
    Abstract: An all-additive apparatus for direct fabrication of nanometer-scale planar and multilayer structures that performs “pick-and-place” retrieval and deposition of materials comprises a tip and a controller and transport mechanism configured for causing the tip to acquire a transferable material and deposit at least a portion of the acquired transferable material at a predetermined location onto a substrate, without the use of a bridging medium, in order to directly assemble a structure. The tip may be submillimeter-scale, may comprise a plurality of sub-tips disposed in a predetermined arrangement, and/or may mechanically vibrate. Mechanical vibration of the tip may be monitored. The tip may acquire the transferable material from a reservoir. The assembled structure may be cured on the substrate.
    Type: Application
    Filed: August 15, 2011
    Publication date: December 8, 2011
    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Brian Hubert, Joseph Jacobson, Aggelos Bletsas
  • Patent number: 7998528
    Abstract: An all-additive method for direct fabrication of nanometer-scale planar and multilayer structures comprises the steps of acquiring a transferable material with a submillimeter-scale tip, depositing at least a portion of the acquired first transferable material at a predetermined location onto a substrate without a bridging medium, and repeating to create a structure using the transferable material.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: August 16, 2011
    Assignee: Massachusetts Institute of Technology
    Inventors: Brian Hubert, Joseph Jacobson, Aggelos Bletsas
  • Patent number: 7294449
    Abstract: Materials, compounds and compositions for radiation patternable functional thin films, methods of synthesizing such materials and compounds, and methods for forming an electronically functional thin film and structures including such a film. The compounds and compositions generally include (a) nanoparticles of an electronically functional material or substance and (b) ligands containing a (photo)reactive group. The method generally includes the steps of (1) irradiating the compound and/or composition, and (2) curing the irradiated compound and/or composition, generally to form an electronically functional film. The functional thin film includes a sintered mixture of nanoparticles. The thin film exhibits improved morphology and/or resolution relative to an otherwise identical structure made by an identical process, but without the (photo)functional group on the ligand, and/or relative to an otherwise identical material patterned by a conventional graphics art-based printing process.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: November 13, 2007
    Assignee: Kovio, Inc.
    Inventors: Christopher Gudeman, Joerg Rockenberger, Brian Hubert, Criswell Choi, Alfred Renaldo
  • Patent number: 6957608
    Abstract: A method of and device for controlled printing using liquid embossing techniques is disclosed. In accordance with the embodiments of the invention a stamp comprises a differentiated embossing surface with protruding and recessed surfaces to enhance the ability of the stamp to selectively displace liquid ink from a print surface and/or remove solvent from the liquid in a soft curing process. A stamp with differentiated surfaces is fabricated by selectively coating, or otherwise treating the protruding features, the recessed features, or a combination thereof, such that the surface energies and/or wettability of the protruding surfaces and the recessed surfaces are differentiated.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: October 25, 2005
    Assignee: Kovio, Inc.
    Inventors: Brian Hubert, Colin Bulthaup, Chris Gudeman, Chris Spindt, Scott Haubrich, Mao Takashima, Joerg Rockenberger, Klaus Kunze, Fabio Zurcher
  • Publication number: 20040026007
    Abstract: An all-additive method for direct fabrication of nanometer-scale planar and multilayer structures utilizes the tip of a scanning probe microscope and a material reservoir. True “pick-and-place” retrieval and deposition of materials with a wide range of electrical, chemical, and mechanical properties is thereby facilitated.
    Type: Application
    Filed: February 14, 2003
    Publication date: February 12, 2004
    Inventors: Brian Hubert, Joseph Jacobson, Aggelos Bletsas
  • Publication number: 20030070569
    Abstract: The current invention is directed to micro-stencil devices and methods. A micro-stencil, in accordance with this invention, comprises a patterned stencil membrane formed from a polymeric layer patterned with stencil features preferably having lateral dimensions in a range of 10 micron to 100 nanometers or less. The micro-stencil preferably includes a porous backing membrane coupled to the stencil membrane to control the flow of print fluids, to allow for two-way flow of print fluids and/or curing gases during a printing operation. The stencil membrane is preferably configured to directly print the stencil features onto a suitable print medium surface. The micro-stencil of the instant invention, is preferably utilized for printing structures comprising interconnected layers, such as micro-circuits, and/or structures comprising polymer arrays.
    Type: Application
    Filed: December 4, 2001
    Publication date: April 17, 2003
    Inventors: Colin Bulthaup, Brian Hubert, Kevin Hubert, Joseph Jacobson