Abstract: The electronic properties (such as electron mobility, resistivity, etc.) of an electronic material in operation in an electronic device or electronic circuit can be modified/enhanced when subjected to dynamic or stationary magnetic fields with current flowing through the electronic material. Heating or cooling of the electronic material further enhances the electronic properties.

Abstract: The electronic properties (such as electron mobility, resistivity, etc.) of an electronic material in operation in an electronic device or electronic circuit can be modified/enhanced when subjected to dynamic or stationary magnetic fields with current flowing through the electronic material. Heating or cooling of the electronic material further enhances the electronic properties.

Abstract: The electronic properties (such as electron mobility, resistivity, etc.) of an electronic material can be modified/enhanced when subjected to dynamic or stationary magnetic fields in conjunction with select cycles of heating, cooling and passage of electric current through the material. This “processing” includes one or more cycles using combinations of the aforementioned variables.

Abstract: Heat energy is converted into mechanical energy through the mobilization of electrical charges within a thermoelectric material. A plurality of plugs of thermoelectric material are mounted on a rotor. Heat energy is directed to one end of each of the plugs. The heat energy mobilizes free charges in the plugs which collect at the relatively cooler end, thereby electrically polarizing the plugs. A pulsed electromagnetic force field acts upon the polarized plugs to exert a torque on the rotor.

Abstract: A method of making a cutting blade using a fiber composite tape formed into a continuous closed loop. The tape is selected and prepared such that at least some of the fibers form an acute angle with the cutting edge.

Abstract: A method of making a cutting blade using a fiber composite tape formed into a continuous closed loop. The tape is selected and prepared such that at least some of the fibers form an acute angle with the cutting edge.

Abstract: An apparatus and method for wafering an ingot of semiconductor material. Wafering blades are fabricated from one or more layers of a fiber reinforced plastic tape and coated with an abrasive material which is embedded into the exposed flat surfaces of the blades. An assembly of such blades is used in a wafering device in which the blades are reciprocated while the ingot is plunged against the cutting edges of the blades. The primary cutting action occurs as exposed ends of the fiber material at the blade edges contact the ingot. The abrasive material on the blade sides provides additional side cutting action and produces a polished finish on the surfaces of the resulting wafers.