Patents by Inventor Brian Iee Tollison

Brian Iee Tollison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COATING/REPAIRING PROCESS USING ELECTROSPARK WITH PSP ROD
    Publication number: 20140017415
    Abstract: An electrospark deposition electrode and an associated method for depositing coatings using the electrode are provided. The electrode includes a powder of a first metal and a powder of a second metal. The second metal is a braze alloy including nickel, the second metal having a lower melting point than the first metal. The powder of the first metal and the powder of the second metal are sintered together to form the electrode so that the powders are comingled but not combined within the electrode. The method includes depositing a layer of the first metal onto the substrate using an electrospark deposition process.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 16, 2014
    Applicant: General Electric Company
    Inventors: Dechao Lin, David Vincent Bucci, Srikanth Chandrudu Kottilingam, Yan Cui, Brian Iee Tollison, David Edward Schick