Patents by Inventor Brian J. Hazen

Brian J. Hazen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protective encapsulation for a phototransducer including a surfactant film
    Patent number: 6433332
    Abstract: A method of encapsulating a phototransducer comprises mounting the phototransducer on a substrate, depositing a surfactant on the substrate, and depositing an encapsulant on the substrate over the surfactant. The surfactant alters a surface tension of the substrate. The encapsulant forms a protective structure that protects the phototransducer.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: August 13, 2002
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Gerald J. Chin, Philip E. Johnson, E. Geoffrey Miller, Brian J. Hazen, Gary L. McEachern
  • Method of protecting aluminum nitride circuit substrates during electroless plating using sol-gel oxide films and article made therefrom
    Patent number: 5358597
    Abstract: The present invention describes a process for protecting aluminum nitride circuit substrates during electroless plating using a sol-gel technique. The aluminum nitride substrate is coated with a metal. The coated substrate is etched to form a circuit pattern thereby exposing the aluminum nitride. The etched substrate is placed in a solution of tetraethylorthosilicate and withdrawn. The substrate is dried in air and then baked in an oven to remove all of the organic solvents leaving a stoichio metric film of silica on the exposed substrate. The substrate is then placed in an electroless plating solution and the circuit pattern is plated to a predetermined thickness.
    Type: Grant
    Filed: August 10, 1993
    Date of Patent: October 25, 1994
    Assignee: GTE Laboratories Incorporated
    Inventors: Sandra L. Smith, Brian J. Hazen
  • Method of protecting aluminum nitride circuit substrates during electroless plating using a surface oxidation treatment
    Patent number: 5306389
    Abstract: A process for protecting aluminum nitride circuit substrates during electroless plating using surface oxidation. The aluminum nitride substrate is coated with a metal stack. The coating on the substrate is etched to form a circuit pattern. The patterned substrate is then fired in an oxidizing atmosphere at a temperature and time sufficient to convert the exposed aluminum nitride to aluminum oxide. After this conversion, the substrate is plated in an electroless solution forming a microwave circuit ready for component attachment and packaging.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: April 26, 1994
    Assignee: Osram Sylvania Inc.
    Inventors: Sandra L. Smith, Brian J. Hazen