Patents by Inventor Brian J. Jensen

Brian J. Jensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6956066
    Abstract: A fully imidized, solvent-free polyimide foam having excellent mechanical, acoustic, thermal, and flame resistant properties is produced. A first solution is provided, which includes one or more aromatic dianhydrides or derivatives of aromatic dianhydrides, and may include one or more aromatic diamines, dissolved in one or more polar solvents, along with an effective amount of one or more blowing agents. This first solution may also advantageously include effective amounts respectively of one or mores catalysts, one or more surfactants, and one or more fire retardants. A second solution is also provided which includes one or more isocyanates. The first and second solutions are rapidly and thoroughly mixed to produce an admixture, which is allowed to foam—in an open container, or in a closed mold—under ambient conditions to completion produce a foamed product. This foamed product is then cured by high frequency electromagnetic radiation, thermal energy, or a combination thereof.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: October 18, 2005
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Juan M. Vazquez, Roberto J. Cano, Brian J. Jensen, Erik S. Weiser
  • Publication number: 20040249002
    Abstract: A fully imidized, solvent-free polyimide foam having excellent mechanical, acoustic, thermal, and flame resistant properties is produced. A first solution is provided, which includes one or more aromatic dianhydrides or derivatives of aromatic dianhydrides, and may include one or more aromatic diamines, dissolved in one or more polar solvents, along with an effective amount of one or more blowing agents. This first solution may also advantageously include effective amounts respectively of one or mores catalysts, one or more surfactants, and one or more fire retardants. A second solution is also provided which includes one or more isocyanates. The first and second solutions are rapidly and thoroughly mixed to produce an admixture, which is allowed to foam—in an open container, or in a closed mold—under ambient conditions to completion produce a foamed product. This foamed product is then cured by high frequency electromagnetic radiation, thermal energy, or a combination thereof.
    Type: Application
    Filed: February 11, 2004
    Publication date: December 9, 2004
    Applicant: Administrator of the National Aeronautics and Space Administration
    Inventors: Juan M. Vazquez, Roberto J. Cano, Brian J. Jensen, Erik S. Weiser
  • Patent number: 6288209
    Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4′-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: September 11, 2001
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 6191252
    Abstract: This invention is an improvement in standard polymerizations procedures, i.e., addition-type and step-growth type polymerizations, wherein momomers are reacted to form a growing polymer chain. The improvement includes employing an effective amount of a trifunctional monomer (such as a trifunctional amine, anhydride, or phenol) in the polymerization procedure to form a mixture of polymeric materials consisting of branced polymers, star-shaped polymers, and linear polymers. This mixture of polymeric materials has a lower melt temperature and a lower melt viscosity than corresponding linear polymeric materials of equivalent molecular weight.
    Type: Grant
    Filed: June 18, 1996
    Date of Patent: February 20, 2001
    Inventor: Brian J. Jensen
  • Patent number: 6166174
    Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of a non-reactive endcapper, such as phthalic anhydride. Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. Polyimides that are more rigid in nature require more APB to impart processability than polyimides that are less rigid in nature. The copolymers that result from using APB to enhance processability have a unique combination of properties including: excellent thin film properties, low pressure processing (200 psi and below), improved toughness, improved solvent resistance, improved adhesive properties, improved composite mechanical properties, long term melt stability (several hours at 390 C.), and lower melt viscosities.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: December 26, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 6133401
    Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: October 17, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 6061134
    Abstract: A modification to a commercial Fourier Transform (FT) Raman spectrometer is presented for the elimination of thermal backgrounds in the FT Raman spectra. The modification involves the use of a mechanical optical chopper to modulate the continuous wave laser, remote collection of the signal via fiber optics, and connection of a dual-phase digital-signal-processor (DSP) lock-in amplifier between the detector and the spectrometer's collection electronics to demodulate and filter the optical signals. The resulting Modulated Fourier Transform Raman Fiber-Optic Spectrometer is capable of completely eliminating thermal backgrounds at temperatures exceeding 300.degree. C.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: May 9, 2000
    Assignees: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration, Old Dominion University Research Foundation
    Inventors: Brian J. Jensen, John B. Cooper, Kent L. Wise
  • Patent number: 5965687
    Abstract: This invention is an improvement in standard polymerizations procedures, i.e., addition-type and step-growth type polymerizations, wherein momomers are reacted to form a growing polymer chain. The improvement includes employing an effective amount of a trifunctional monomer (such as a trifunctional amine, anhydride, or phenol) in the polymerization procedure to form a mixture of polymeric materials consisting of branced polymers, star-shaped polymers, and linear polymers. This mixture of polymeric materials has a lower melt temperature and a lower melt viscosity than corresponding linear polymeric materials of equivalent molecular weight.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: October 12, 1999
    Assignee: The United States of America represented by the Adminstrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 5866676
    Abstract: Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA) and endcapping with an effective amount of a non-reactive endcapper. Within a narrow ratio of diamines, from .sup..about. 50% ODA/50% APB to .sup..about. 95% ODA/5% APB, the copolyimides prepared with BPDA have a unique combination of properties that make them very attractive for various applications. This unique combination of properties includes low pressure processing (200 psi and below), long term melt stability (several hours at 390.degree. C.), improved toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: February 2, 1999
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 5644022
    Abstract: Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA), and terminating with an effective amount of a reactive endcapper. The reactive endcappers employed include 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride) (NA). Within a relatively narrow ratio of diamines, from .sup..about. 50% ODA/50% APB to .sup..about. 95% ODA/5% APB, the copolyimides prepared with BPDA and terminated with reactive endgroups have a unique combination of properties that make them very attractive for a number of applications. This unique combination of properties includes low pressure processing (200 psi and below), long term melt stability (several hours at 300.degree. C.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: July 1, 1997
    Assignee: The United States of America as represented by the Admninistrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 5599993
    Abstract: Four phenylethynyl amine compounds--3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone--were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and phenylethynyl-terminated imide oligomers with various molecular weights and compositions were prepared and characterized. These oligomers were cured at 300.degree. C. to 400.degree. C. to provide crosslinked polyimides with excellent solvent resistance, high strength and modulus and good high temperature properties. Adhesive panels, composites, films and moldings from these phenylethynyl terminated imide oligomers gave excellent mechanical performance.
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: February 4, 1997
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Paul M. Hergenrother, Robert G. Bryant, Brian J. Jensen, Stephen J. Havens
  • Patent number: 5498803
    Abstract: Poly(arylene ether)s containing pendent ethynyl and substituted ethynyl groups and poly(arylene ether) copolymers containing pendent ethynyl and substituted ethynyl groups are readily prepared from bisphenols containing ethynyl and substituted ethynyl groups. The resulting polymers are cured up to 350.degree. C. to provide crosslinked poly(arylene ether)s with good solvent resistance, high strength and modulus.
    Type: Grant
    Filed: March 7, 1994
    Date of Patent: March 12, 1996
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Paul M. Hergenrother, Brian J. Jensen
  • Patent number: 5446204
    Abstract: A composition of matter having the general structure: ##STR1## (wherein X is F, Cl, or NO.sub.2, and Y is CO, SO.sub.2 or C(CF.sub.3).sub.2) is employed to terminate a nucleophilic reagent, resulting in the exclusive production of phenylethynyl terminated reactive oligomers which display unique thermal characteristics. A reactive diluent having the general structure: ##STR2## (wherein R is any aliphatic or aromatic moiety) is employed to decrease the melt viscosity of a phenylethynyl terminated reactive oligomer and to subsequently react therewith to provide a thermosetting material of enhanced density. These materials have features which make them attractive candidates for use as composite matrices and adhesives.
    Type: Grant
    Filed: May 16, 1994
    Date of Patent: August 29, 1995
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Robert G. Bryant, Brian J. Jensen, Paul M. Hergenrother
  • Patent number: 5426234
    Abstract: A composition of matter having the general structure: ##STR1## (wherein X is F, Cl, or NO.sub.2, and Y is CO, SO.sub.2 or C(CF.sub.3).sub.2) is employed to terminate a nucleophilic reagent, resulting in the exclusive production of phenylethynyl terminated reactive oligomers which display unique thermal characteristics. A reactive diluent having the general structure: ##STR2## (wherein R is any aliphatic or aromatic moiety) is employed to decrease the melt viscosity of a phenylethynyl terminated reactive oligomer and to subsequently react therewith to provide a thermosetting material of enhanced density. These materials have features which make them attractive candidates for use as composite matrices and adhesives.
    Type: Grant
    Filed: May 16, 1994
    Date of Patent: June 20, 1995
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Robert G. Bryant, Brian J. Jensen, Paul M. Hergenrother
  • Patent number: 5418300
    Abstract: Crystalline imide/arylene ether block copolymers are prepared by reacting anhydride terminated poly(amic acids) with amine terminated poly(arylene ethers) in polar aprotic solvents and chemically or thermally cyclodehydrating the resulting intermediate poly(amic acids). The block copolymers of the invention have one glass transition temperature or two, depending on the particular structure and/or the compatibility of the block units. Most of these crystalline block copolymers form tough, solvent resistant films with high tensile properties. While all of the copolymers produced by the present invention are crystalline, testing reveals that copolymers with longer imide blocks or higher imide content have increased crystallinity.
    Type: Grant
    Filed: April 8, 1994
    Date of Patent: May 23, 1995
    Assignee: The United States of America as represented by the Administrator, National Aeronautics and Space Administration
    Inventors: Brian J. Jensen, Paul M. Hergenrother, Robert G. Bass
  • Patent number: 5412066
    Abstract: Four phenylethynyl amine compounds--3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone--were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and phenylethynyl-terminated imide oligomers with various molecular weights and compositions were prepared and characterized. These oligomers were cured at 300.degree. C. to 400.degree. C. to provide crosslinked polyimides with excellent solvent resistance, high strength and modulus and good high temperature properties. Adhesive panels, composites, films and moldings from these phenylethynyl terminated imide oligomers gave excellent mechanical performance.
    Type: Grant
    Filed: March 3, 1994
    Date of Patent: May 2, 1995
    Assignee: Ther United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Paul M. Hergenrother, Robert G. Bryant, Brian J. Jensen, Stephen J. Havens
  • Patent number: 5344982
    Abstract: Diamines containing pendent ethynyl and substituted ethynyl groups are synthesized. These diamines are reacted with dianhydrides to form polyamide acids, which are chemically or thermally cyclodehydrated to form polyimides and copolyimides with pendent ethynyl groups. Upon heating, the pendent ethynyl groups react to form crosslinked resins that are useful as adhesives, composite matrices, coatings, moldings and films.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: September 6, 1994
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Paul M. Hergenrother, Brian J. Jensen
  • Patent number: 5312994
    Abstract: A composition of matter having the general structure: ##STR1## (wherein X is F, Cl, or NO.sub.2, and Y is CO, SO.sub.2 or C(CF.sub.3).sub.2) is employed to terminate a nucleophilic reagent, resulting in the exclusive production of phenylethynyl terminated reactive oligomers which display unique thermal characteristics. A reactive diluent having the general structure: ##STR2## (wherein R is any aliphatic or aromatic moiety) is employed to decrease the melt viscosity of a phenylethynyl terminated reactive oligomer and to subsequently react therewith to provide a thermosetting material of enhanced density. These materials have features which make them attractive candidates for use as composite matrices and adhesives.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: May 17, 1994
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Robert G. Bryant, Brian J. Jensen, Paul M. Hergenrother
  • Patent number: 5268444
    Abstract: Phenylethynyl-terminated poly(arylene ethers) are prepared in a wide range of molecular weights by adjusting monomer ratio and adding an appropriate amount of 4-fluoro-4'-phenylethynylbenzophenone during polymer synthesis. The resulting phenylethynyl-terminated poly(arylene ethers) react and crosslink upon curing for one hour at 350.degree. C. to provide materials with improved solvent resistance, higher modulus and better high temperature properties than the linear, uncrosslinked polymers.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: December 7, 1993
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Brian J. Jensen, Robert G. Bryant, Paul M. Hergenrother
  • Patent number: 5112923
    Abstract: Imide/arylene ether block copolymers are prepared by reacting anhydride terminated poly(amic acids) with amine terminated poly(arylene ethers) in polar aprotic solvents and chemically or thermally cyclodehydrating the resulting intermediate poly(amic acids). The resulting block copolymers have one glass transition temperature or two, depending upon the particular structure and/or the compatibility of the block units. Most of these block copolymers form tough, solvent resistant films with high tensile properties.
    Type: Grant
    Filed: November 21, 1989
    Date of Patent: May 12, 1992
    Assignee: Administrator of the National Aeronautics and Space Administration
    Inventors: Brian J. Jensen, Paul M. Hergenrother, Robert G. Bass