Patents by Inventor Brian J. Love

Brian J. Love has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic based substrate for electronic circuit system modules
    Patent number: 4943468
    Abstract: An electronic system having a first printed wiring board, a first integrated circuit carrier positionable on the printed wiring board and a substrate having a central portion formed of ceramic material. The substrate central portion has a specific thermal conductivity greater than 1.5.times.10.sup.-5 Wm.sup.2 /g.degree.C. The substrate may comprise a ceramic material formed in combination with a modifier of the type which increases fracture toughness thereby inhibiting crack initiation and growth. In an alternate form of the invention the elctronic system includes a substrate having a central portion formed of ceramic material and first and second opposing surfaces each clad with a metallic layer of predetermined thickness.
    Type: Grant
    Filed: October 31, 1988
    Date of Patent: July 24, 1990
    Assignee: Texas Instruments Incorporated
    Inventors: Robert J. Gordon, Brian J. Love, Robert K. Peterson, Burhan Ozmat