Abstract: A wireless and batteryless pressure sensor apparatus comprises of a SAW sensor and an antenna mounted on a printed circuit board. Optionally, and RFID tag in used in combination with the SAW sensor. A sensor antenna and a RFID antenna can be located on the printed circuit board such that the antennas communicate electrically with the sensor and the RFID device. The sensor can be interrogated utilizing a radio frequency, which is used to excite a SAW crystal inside the sensor. The interrogation signal causes the SAW to resonate wherein a resonant frequency changes with the pressure and temperature that is applied to the sensor. An interrogator can receive a return (echo) signal representing a change in SAW sensor properties (e.g., diaphragm change). A printed circuit board can be mounted on a stainless steel port and overpackaged with standard processes for hermetically sealing the sensor, or sensor and RFID device with at least one antenna.

Abstract: The SAW sensor in a stainless steel button package having a diaphragm and mounted on a threaded port. Package can hermetically seal a sensor and RFID-antenna assemblies from media. Sensor diaphragm is exposable to media. Sensor and RFID antennas communicate electrically with SAW sensor and RFID device, respectively, for sensor measurements and identification. Antennas receive RF interrogation signal from a nearby interrogator/transceiver and send reflected RF signals back to the interrogator unit containing sensor measurement and sensor ID. TRF signal excites a SAW resonator inside the sensor and causes the SAW to resonate wherein resonant frequency changes with pressure and temperature applied to the sensor. Antennas could be printed circuit board antennas, helical antennas, loop antennas, any other commercially available off-the-shelf antennas or a combination of these.

Abstract: A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.

Abstract: The SAW sensor in a stainless steel button package having a diaphragm and mounted on a threaded port. Package can hermetically seal a sensor and RFID-antenna assemblies from media. Sensor diaphragm is exposable to media. Sensor and RFID antennas communicate electrically with SAW sensor and RFID device, respectively, for sensor measurements and identification. Antennas receive RF interrogation signal from a nearby interrogator/transceiver and send reflected RF signals back to the interrogator unit containing sensor measurement and sensor ID. TRF signal excites a SAW resonator inside the sensor and causes the SAW to resonate wherein resonant frequency changes with pressure and temperature applied to the sensor. Antennas could be printed circuit board antennas, helical antennas, loop antennas, any other commercially available off-the-shelf antennas or a combination of these.

Abstract: A wireless and batteryless pressure sensor apparatus comprises of a SAW sensor and an antenna mounted on a printed circuit board. Optionally, and RFID tag in used in combination with the SAW sensor. A sensor antenna and a RFID antenna can be located on the printed circuit board such that the antennas communicate electrically with the sensor and the RFID device. The sensor can be interrogated utilizing a radio frequency, which is used to excite a SAW crystal inside the sensor. The interrogation signal causes the SAW to resonate wherein a resonant frequency changes with the pressure and temperature that is applied to the sensor. An interrogator can receive a return (echo) signal representing a change in SAW sensor properties (e.g., diaphragm change). A printed circuit board can be mounted on a stainless steel port and overpackaged with standard processes for hermetically sealing the sensor, or sensor and RFID device with at least one antenna.

Abstract: A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.

Abstract: A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed between a base and a cover. An adhesive is generally for securing one or more of the surface acoustic wave die to the base, which is configured with a pattern of cross hatches formed thereon in order to permit the adhesive to adhere to the base. The adhesive is placed under a location wherein surface acoustic wave die is to be located. The surface acoustic wave die is thereafter pressed into the adhesive, whereby upon a subsequent curing of the adhesive, the surface acoustic wave die is held securely in place, while remaining flexible as required by sensing applications associated with the surface acoustic save sensor.

Abstract: A wireless sensor fixture system and method are disclosed in which an antenna block is provided that includes a plurality of grooves, wherein such grooves maintain a plurality of antennas located on a portion of the antenna block. A top locator block can be positioned above the antenna block, wherein the top locator comprises a top surface having depression thereon for receiving and locating a patch, which can receives wireless signals from the antennas for sensor testing thereof, wherein the patch comprises a SAW sensor and an RFID tag over-molded into the patch. Additionally, an antenna cover can be connected to the antenna block for protecting the plurality of antennas and wiring thereof. A BNC connector protrudes from the antenna block and is electrically connected to the plurality of antennas via the wiring thereof.

Abstract: A wireless sensor is disclosed, which includes a substrate upon which the wireless sensor can be configured. The wireless sensor includes a plurality of surface acoustic wave (SAW) sensing elements configured in parallel with one another upon the substrate, wherein one or more of the SAW sensing elements is responsive to a wireless frequency range that differs from that of a wireless frequency range of at least one other SAW sensing element among the group of SAW sensing elements. It is this parallelism that permits all of the SAW sensing elements to receive the same strain when pressure is applied thereon. In doing so, the capability for three separate interrogators to measure strain is provided.

Abstract: A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.

Abstract: A sensor pre-load and welding apparatus and method are disclosed. A weld fixture apparatus includes a fixture base upon which a sensor package having a sensor base and a sensor cover is located, and a load bar associated with a spring, wherein the load bar provides a specific weight to the fixture base in order to assist in maintaining the sensor cover and the sensor base parallel to one another upon the fixture base. An adjustable load foot is generally located above the fixture base, such that the adjustable load foot applies a pre-determined load with a specific weight to the sensor base in order to maintain the sensor cover and the sensor base securely in place as the sensor base and the sensor cover are welded to one another in order to configure the sensor package.

Abstract: A pre-load weld fixture apparatus and method are disclosed, which include a stationary pivot block attached to a base, wherein the stationary pivot block is located adjacent to a nest for maintaining an object to be welded. Additionally a pivot arm is associated with a pivot arm insert, wherein the pivot arm rotates about a pivot point provided by a pin press component associated with the stationary pivot block, such that the pivot point is fixed to the stationary pivot block in relation to the object to be welded and wherein the pivot arm is positioned parallel to the nest. A spring block can be connected to the stationary pivot block, wherein the spring block provides tension to the pivot arm in order to permit a user to maintain the object upon the base with a desired tension for welding thereof. Finally, a torsion spring can be maintained by the spring block, wherein the torsion spring allows the spring block to provide tension to the pivot arm.

Abstract: A sensor apparatus and method are disclosed herein. A base is generally located proximate to a cover. A sensor element (e.g., quartz, silicon, ceramic, and the like) can be located on the base, such that the cover and the base form a clearance between the cover and the base. The clearance can be configured such that when the cover is at its smallest dimension within the tolerance range thereof and the base is at its largest dimension within the tolerance range thereof there is a clearance between them. Additionally, a sensor diaphragm and a dimple can be incorporated into the cover, wherein the dimple is in intimate contact with the sensor element at all pressure levels and temperatures thereof.

Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.

Abstract: In general, a pressure rail having a top surface and a bottom surface and one or more pressure inlets to a pressure channel can be located within the pressure rail. The pressure channel can be drilled into the pressure rail. A plurality of patch depressions can be formed into a plurality of sealing surfaces on the top surface of the pressure rail upon which a patch is positioned. A plurality of antenna blocks is generally disposed upon the pressure rail, wherein each antenna block thereof includes at least two antennas. Two antennas can be connected to a respective antenna block among the plurality of antenna blocks utilizing a silicone adhesive. Each antenna block is respectively located on the pressure rail in order to provide wireless data indicative of pressure and temperature conditions associated with each patch among the plurality of patches.

Abstract: A sensor apparatus and method are disclosed herein, including a sensor element located on a base and a cover located proximate to the base. The cover generally includes a sensor diaphragm and a dimple that can form a part of the cover. A flanged area or flanged portion can also be connected to the bottom portion of the cover. The flanged area provides a surface for contacting a fixture to which the sensor apparatus attaches and holding the sensor apparatus to the fixture in a manner which prevents the sensor diaphragm from contacting the fixture and inducing errors during sensor operations thereof. The cover also can include a flanged or brim-shaped portion which is connected to and surrounds the bottom portion of the cover. The flanged portion can be positioned parallel to the sensor diaphragm.

Abstract: A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.

Abstract: A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.

Abstract: A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.