Patents by Inventor Brian J. O'Hara

Brian J. O'Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming sputter target assemblies having a controlled solder thickness
    Patent number: 8993122
    Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: March 31, 2015
    Assignee: Praxair Technology, Inc.
    Inventors: Paul S. Gilman, Binu Mathew, Brian J. O'Hara, Thomas J. Hunt, Peter McDonald, Holger J. Koenigsmann
  • METHOD FOR FORMING SPUTTER TARGET ASSEMBLIES HAVING A CONTROLLED SOLDER THICKNESS
    Publication number: 20130087453
    Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.
    Type: Application
    Filed: November 26, 2012
    Publication date: April 11, 2013
    Inventors: Paul S. Gilman, Binu Mathew, Brian J. O'Hara, Thomas J. Hunt, Peter McDonald, Holger J. Koenigsmann
  • Method for forming sputter target assemblies having a controlled solder thickness
    Patent number: 8342383
    Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: January 1, 2013
    Assignee: Praxair Technology, Inc.
    Inventors: Paul S. Gilman, Binu Mathew, Brian J. O'Hara, Thomas J. Hunt, Peter McDonald, Holger J. Koenigsmann