Patents by Inventor Brian J. Wood

Brian J. Wood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974724
    Abstract: An endoscope may include a shaft having a longitudinal axis, a first image sensor facing a distal direction, and a second image sensor facing a lateral direction. The endoscope may further include a tubular member having a lumen, the lumen having a distal-end opening and defining a longitudinal axis through a center of the lumen. The tubular member may be movable between a first configuration and a second configuration. In the first configuration of the tubular member, the longitudinal axis of the lumen may be parallel to the longitudinal axis of the shaft. In the second configuration of the tubular member, the longitudinal axis of the lumen may extend through a lateral opening in a wall of the shaft.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: May 7, 2024
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Andrew Calabrese, Louis J. Barbato, Brian Gaffney, Mark D. Wood
  • Publication number: 20240107118
    Abstract: Some embodiments described in this disclosure are directed to one or more electronic devices that facilitate control of playback of a live content item displayed in a playback user interface. Some embodiments described in this disclosure are directed to one or more electronic devices that facilitate display of key content corresponding to a live content item in a key content user interface. Some embodiments described in this disclosure are directed to one or more electronic devices that facilitate concurrently display of multiple content items in a Multiview user interface. Some embodiments described in this disclosure are directed to one or more electronic devices that facilitate display of insights corresponding to a content item displayed in a playback user interface.
    Type: Application
    Filed: September 23, 2023
    Publication date: March 28, 2024
    Inventors: Christopher J. ELLINGFORD, Kevin M. SANDLOW, Lucio MORENO RUFO, Fredric R. VINNA, Policarpo B. WOOD, Antonio ALLEN, William D. CARPENTER, Anton M. DAVYDOV, Jonathan SILVIO, Brian K. SHIRAISHI, Gregory T. SCOTT
  • Patent number: 5386224
    Abstract: A discrete ink level sensing system according to the present invention includes a level sensing probe (130) with at least first and second level sensing pads (178, 180) that is placed in an ink reservoir (28). The level sensing system uses electrical conductivity of the ink to detect when the upper surface level of the ink is lower than the lowest points of the level sensing pads. The upper and lower level sensing pads are electrically connected by a sense resistor (182). A voltage sensor (174) detects across the sense resistor a voltage that depends on the ink conductivity and the position of an upper surface level of the ink with respect to the lowest points of the first and second level pads. The value of the voltage is sent to a CPU (154) that signals a user that a predetermined amount of ink should be added to the reservoir.
    Type: Grant
    Filed: April 26, 1993
    Date of Patent: January 31, 1995
    Assignee: Tektronix, Inc.
    Inventors: Ted E. Deur, Clark W. Crawford, Brian J. Wood, Richard Marantz, James D. Buehler
  • Patent number: 5276468
    Abstract: A FRU assembly (10) comprises a melt chamber (20) including multiple subchambers (30) in which sticks of phase change ink (38, 40) are inserted and melted. Melted ink flows through apertures (54) to a reservoir (28) comprising multiple compartments (56). Each compartment contains a channel (90) and a siphon plate (114) that allow a siphon action that siphons melted ink in the compartments to an orifice (100) that leads to an ink jet print head (16). Heaters (52, 82, and 142) under the control of a CPU (154) melt the ink and keep the melted ink at a desired temperature during various modes of operation.
    Type: Grant
    Filed: October 23, 1992
    Date of Patent: January 4, 1994
    Assignee: Tektronix, Inc.
    Inventors: Ted E. Deur, Clark W. Crawford, Brian J. Wood, Richard Marantz, James D. Buehler
  • Patent number: 4808112
    Abstract: A high density connector in which the conductive leads of at least two circuit boards, two flexible circuits, or one of each are interconnected directly without the use of a traditional molded connector with pins captured therein. This is accomplished by overlapping the two boards with the conductive paths on each to be interconnected facing each other. An anisotropic elastomeric polymer material is inserted between the boards and then the sandwich is clamped together compressing the polymer material to provide a low electrical resistance path therethrough to interconnect the conductive paths on the respective circuit boards. One disclosed embodiment utilizes backing plates above and below the sandwich with a plurality of screws passing through registration holes to align the conductive paths and to provide closure of the connector. The other disclosed embodiment is designed to interconnect two boards along substantially the full width of the boards.
    Type: Grant
    Filed: September 25, 1986
    Date of Patent: February 28, 1989
    Assignee: Tektronix, Inc.
    Inventors: Brian J. Wood, Peter M. Compton, Jerome P. Gianotti
  • Patent number: 4718861
    Abstract: A cable strain relief clamp assembly to securely hold a bundle of flat cables while providing quick assembly/disassembly from the main unit chassis. Identical clamp halves are positioned and fastened at a specified location on the cable bundle. The clamp (with the attached cable) is then snapped onto a bracket to become a subassembly unit. The bracket mates with the main unit chassis utilizing a snap fit detail oriented perpendicular to typical cable axial forces, thus fixing the cables in place. Accommodating varied thicknesses and numbers of cables can be accomplished by varying the aperture of the clamp. The clamp may also provide an electrical ground path between cable and chassis. Other features of the present invention are that: (1) multiple cables and varied widths can be accomplished; (2) it can be detached from main unit chassis without use of fasteners; (3) it does not depend on termination of the cables in male/female relationship; and (4) a consistent part outline is provided for all applications.
    Type: Grant
    Filed: June 23, 1986
    Date of Patent: January 12, 1988
    Assignee: Tektronix, Inc.
    Inventor: Brian J. Wood
  • Patent number: 4700275
    Abstract: A modularized packaging system for enclosing circuit components of an electronic instrument. That system includes one or more "C" frame modules each having top, bottom and side wall portions interconnected one to the other orthogonally. In addition, there is provided interconnection means for interconnecting, side by side, as many of the "C" frame modules as desired with a side panel provided for closing the outwardly facing open sides, if any, of the outermost "C" frame modules. To complete the package, front and rear end assemblies are provided to close those portions of the interconnected "C" frame modules.
    Type: Grant
    Filed: June 23, 1986
    Date of Patent: October 13, 1987
    Assignee: Tektronix, Inc.
    Inventor: Brian J. Wood