Abstract: Modular waveguide to printed circuit board (PCB) interconnected radar, apparatuses, and methods of using a modular waveguide to PCB interconnected radar are disclosed. In a particular embodiment, a modular waveguide to printed circuit board (PCB) interconnected radar is disclosed that includes a waveguide launch PCB and a waveguide interconnect coupled to the waveguide launch PCB. The radar also includes an antenna launch PCB coupled to the waveguide interconnect.

Abstract: A method for increasing capacitive response to applied pressure by including a glass layer in the air gap of an improved capacitive sense element. The glass layer has additional thickness compared to previously known capacitive sense elements. The additional thickness is selected to achieve a predetermined increase in dielectric constant across the gap between electrodes. In an illustrative embodiment, the resulting capacitive sense element includes a gap having two dielectric media, air and glass, between the electrodes, wherein the thickness of the glass media in the gap and the thickness of the remaining air gap are predetermined based on the dielectric constant of glass and air to achieve desired capacitive response characteristics of the sensor design.

Abstract: A method for increasing capacitive response to applied pressure by including a glass layer in the air gap of an improved capacitive sense element. The glass layer has additional thickness compared to previously known capacitive sense elements. The additional thickness is selected to achieve a predetermined increase in dielectric constant across the gap between electrodes. In an illustrative embodiment, the resulting capacitive sense element includes a gap having two dielectric media, air and glass, between the electrodes, wherein the thickness of the glass media in the gap and the thickness of the remaining air gap are predetermined based on the dielectric constant of glass and air to achieve desired capacitive response characteristics of the sensor design.