Patents by Inventor Brian Kaiser

Brian Kaiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10960425
    Abstract: A material delivery assembly includes a delivery fitting attached to a drive shaft and including an outer wall that extends perpendicularly from a receiving surface. Apportioning slots are defined within the outer wall. A dispersion chamber is defined within the outer wall and the receiving surface. A material delivery conduit extends to a delivery port located within the dispersion chamber and is proximate the receiving surface of the delivery fitting. The material delivery port selectively delivers a viscous material to the receiving surface. The drive shaft and the delivery fitting are rotationally operated to define an apportioning state of the delivery fitting that is configured to manipulate the viscous material toward an inner surface of the outer wall. The apportioning slots in the apportioning state are configured to regulate passage of the viscous material from the dispersion chamber, through the outer wall and into a disk-shaped spread pattern.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: March 30, 2021
    Assignee: G.P. Reeves Inc.
    Inventors: Brian Kaiser, Kirk Brink
  • Publication number: 20200282419
    Abstract: A material delivery assembly includes a delivery fitting attached to a drive shaft and including an outer wall that extends perpendicularly from a receiving surface. Apportioning slots are defined within the outer wall. A dispersion chamber is defined within the outer wall and the receiving surface. A material delivery conduit extends to a delivery port located within the dispersion chamber and is proximate the receiving surface of the delivery fitting. The material delivery port selectively delivers a viscous material to the receiving surface. The drive shaft and the delivery fitting are rotationally operated to define an apportioning state of the delivery fitting that is configured to manipulate the viscous material toward an inner surface of the outer wall. The apportioning slots in the apportioning state are configured to regulate passage of the viscous material from the dispersion chamber, through the outer wall and into a disk-shaped spread pattern.
    Type: Application
    Filed: March 5, 2019
    Publication date: September 10, 2020
    Inventors: Brian Kaiser, Kirk Brink
  • Patent number: 9807283
    Abstract: A method for synchronizing multiple data feeds includes receiving a first data feed including user-entered textual data and audio segments acquired concurrently with the user-entered textual data from a first device, receiving an additional data feed including audio segments acquired with the additional device, the first data feed and the additional data feed acquired from a common sporting event, identifying one or more distinctive audio events in the one or more audio segments received from the first device and the additional device, determining a timing offset between the first data feed and the additional data feed by comparing the one or more distinctive audio events of the one or more audio segments received from the first device and the additional device and generating a synchronized output feed by establishing a common absolute time for the first data feed and the additional data feed based on the determined timing offset.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: October 31, 2017
    Assignee: Agile Sports Technologies, Inc.
    Inventors: Brian Kaiser, Kyle Murphy, Erik Person, Bryce Kahle
  • Patent number: 9602858
    Abstract: A method for synchronizing multiple data feeds includes receiving a first data feed including user-entered textual data and audio segments acquired concurrently with the user-entered textual data from a first device, receiving an additional data feed including audio segments acquired with the additional device, the first data feed and the additional data feed acquired from a common sporting event, identifying one or more distinctive audio events in the one or more audio segments received from the first device and the additional device, determining a timing offset between the first data feed and the additional data feed by comparing the one or more distinctive audio events of the one or more audio segments received from the first device and the additional device and generating a synchronized output feed by establishing a common absolute time for the first data feed and the additional data feed based on the determined timing offset.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: March 21, 2017
    Assignee: Agile Sports Technologies, Inc.
    Inventors: Brian Kaiser, Kyle Murphy, Erik Person, Bryce Kahle
  • Patent number: 7461736
    Abstract: A method for forming a one-piece integral multi-durometer scraper blade for a conveyor belt cleaner. The scraper blade includes a body extending longitudinally between a first end and a second end and extending transversely between a base and a tip. The body includes a first body portion comprising a first elastomeric material having a first durometer of hardness, and a second body portion comprising a second elastomeric material having a second durometer of hardness.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: December 9, 2008
    Assignee: Martin Engineering Company
    Inventors: Andrew J. Waters, Mark Strebel, Brian Kaiser
  • Patent number: 7348496
    Abstract: Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: March 25, 2008
    Assignee: Intel Corporation
    Inventors: Paul H. Wermer, Brian Kaiser
  • Publication number: 20060131135
    Abstract: A method for forming a one-piece integral multi-durometer scraper blade for a conveyor belt cleaner. The scraper blade includes a body extending longitudinally between a first end and a second end and extending transversely between a base and a tip. The body includes a first body portion comprising a first elastomeric material having a first durometer of hardness, and a second body portion comprising a second elastomeric material having a second durometer of hardness.
    Type: Application
    Filed: December 23, 2005
    Publication date: June 22, 2006
    Inventors: Andrew Waters, Mark Strebel, Brian Kaiser
  • Publication number: 20050099762
    Abstract: The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as organic polymers and organic polymer mixtures. The present invention also includes forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and an embedded capacitor to reduce loop inductance.
    Type: Application
    Filed: December 3, 2004
    Publication date: May 12, 2005
    Inventors: Paul Wermer, Brian Kaiser
  • Patent number: 6829133
    Abstract: Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: December 7, 2004
    Assignee: Intel Corporation
    Inventors: Paul H. Wermer, Brian Kaiser
  • Publication number: 20030205406
    Abstract: The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as organic polymers and organic polymer mixtures. The present invention also includes forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and an embedded capacitor to reduce loop inductance.
    Type: Application
    Filed: April 21, 2003
    Publication date: November 6, 2003
    Applicant: Intel Corporation
    Inventors: Paul H. Wermer, Brian Kaiser
  • Patent number: 6605551
    Abstract: Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: August 12, 2003
    Assignee: Intel Corporation
    Inventors: Paul H. Wermer, Brian Kaiser
  • Publication number: 20020105774
    Abstract: The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as organic polymers and organic polymer mixtures. The present invention also includes forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and an embedded capacitor to reduce loop inductance.
    Type: Application
    Filed: December 8, 2000
    Publication date: August 8, 2002
    Applicant: Intel Corporation
    Inventors: Paul H. Wermer, Brian Kaiser