Abstract: A hinged component fabrication method in which, in a layup stage of fabrication, the component includes a live hinge joining uncured material portions together at a hinge region and comprising a layer of tensile fabric at least partially infiltrated by an uncured elastomer layer at least partially interposed between the tensile fabric and the uncured material portions such that the uncured elastomer blocks the uncured material portions from infiltrating the hinge region. The method may include locating overlapped tensile fabric and elastomer layers in a tool and introducing polymer-based material into the tool such that polymer-based material portions overlap respective opposite ends of the fabric and elastomer layers. The polymer-based material portions are formed to a desired shape using the forming tool so that the fabric and elastomer layers form a live hinge between the polymer-based material portions.

Abstract: A hinged component includes first and second portions of material coupled together by a composite live hinge. The live hinge includes a layer of tensile fabric and a layer of elastomer interposed between the tensile fabric and the material of one or both of the coupled first and second portions. The composite live hinge is capable of joining structural composite materials without the need for scoring, and thereby weakening, the structural composite material along the desired hinge line. The live hinge can be embedded in the materials it joins in a method that is compatible with traditional structural composite layup processes and in a manner which prevents resin from the structural composite materials from infiltrating the tensile fabric and compromising its flexibility.

Abstract: A hinged component fabrication method in which, in a layup stage of fabrication, the component includes a live hinge joining uncured material portions together at a hinge region and comprising a layer of tensile fabric at least partially infiltrated by an uncured elastomer layer at least partially interposed between the tensile fabric and the uncured material portions such that the uncured elastomer blocks the uncured material portions from infiltrating the hinge region. The method may include locating overlapped tensile fabric and elastomer layers in a tool and introducing polymer-based material into the tool such that polymer-based material portions overlap respective opposite ends of the fabric and elastomer layers. The polymer-based material portions are formed to a desired shape using the forming tool so that the fabric and elastomer layers form a live hinge between the polymer-based material portions.

Abstract: Some embodiments are directed to cooling frames for mezzanine cards, mezzanine card assemblies and circuit card assemblies. A recessed cooling frame may be used to dissipate heat generated by components of a mezzanine card. The cooling frame may be directly coupled to a host card or host card cooling frame, thereby reducing the number of interfaces and reducing the thermal resistance of the heat dissipation pathway. The cooling frames of some embodiments may provide more efficient heat dissipation and thereby allow higher performance mezzanine cards to be used. Some embodiments provide a mezzanine card assembly that conforms to the mechanical envelope dimensions of the VITA 20, VITA 42 or VITA 61 specifications.

Abstract: A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

Abstract: A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

Abstract: A hinged component includes first and second portions of material coupled together by a composite live hinge. The live hinge includes a layer of tensile fabric and a layer of elastomer interposed between the tensile fabric and the material of one or both of the coupled first and second portions. The composite live hinge is capable of joining structural composite materials without the need for scoring, and thereby weakening, the structural composite material along the desired hinge line. The live hinge can be embedded in the materials it joins in a method that is compatible with traditional structural composite layup processes and in a manner which prevents resin from the structural composite materials from infiltrating the tensile fabric and compromising its flexibility.

Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.

Abstract: Some embodiments are directed to cooling frames for mezzanine cards, mezzanine card assemblies and circuit card assemblies. A recessed cooling frame may be used to dissipate heat generated by components of a mezzanine card. The cooling frame may be directly coupled to a host card or host card cooling frame, thereby reducing the number of interfaces and reducing the thermal resistance of the heat dissipation pathway. The cooling frames of some embodiments may provide more efficient heat dissipation and thereby allow higher performance mezzanine cards to be used. Some embodiments provide a mezzanine card assembly that conforms to the mechanical envelope dimensions of the VITA 20, VITA 42 or VITA 61 specifications.

Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.