Patents by Inventor Brian Keith Lloyd

Brian Keith Lloyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180323525
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: July 19, 2018
    Publication date: November 8, 2018
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20180309214
    Abstract: A routing assembly for an electronic device has a front face with an array of connectors ports and each of the connector ports contain a first connector mounted therein. A first end of a cable can be directly terminated to the first connectors and the cables can be embedded in a tray that is configured to extend toward a chip package. The cables extend from the tray and terminates to a second connector that can be connected to the chip package so as to provide a communication path between the first connector and the second connector that bypasses any supporting circuit board.
    Type: Application
    Filed: January 11, 2017
    Publication date: October 25, 2018
    Applicant: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory Fitzgerald, Bruce Reed, Gregory Walz, Ayman Isaac
  • Patent number: 10069225
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: September 4, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 10056706
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 21, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 9985367
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: May 29, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20180120906
    Abstract: A computing device includes a first connector near a first wall. The first connector is in communication with a chip package positioned apart for the first wall via a first cable. The chip package includes a chip supported by a support layer. The chip can be supported by a substrate and/or a circuit board. A second connector can be positioned near a second wall and can also be in communication with the chip package via a second cable. If desired, the substrate or circuit board can include a signal board connector that is configured to engage board connectors terminated to ends of the first and second cables.
    Type: Application
    Filed: May 4, 2016
    Publication date: May 3, 2018
    Applicant: Molex, LLC
    Inventors: Bruce REED, Brian Keith LLOYD, Gregory FITZGERALD
  • Publication number: 20180034175
    Abstract: A wire to board connector is provided for connecting cables of cable bypass assemblies to circuitry mounted on a circuit board. The connector has a structure that maintains the geometry of the cable through the connector. The connector includes a pair of edge coupled conductive signal terminals and a ground shield to which the signal terminals are broadside coupled. The connector includes a pair of ground terminals aligned with the signal terminals and both sets of terminals have J-shaped contact portions that flex linearly when the connector is inserted into a receptacle. In another embodiment, the signal terminal contact portions are supported by a compliant member that may deflect when the connectors engage contact pads on a substrate.
    Type: Application
    Filed: January 11, 2016
    Publication date: February 1, 2018
    Applicant: Molex, LLC
    Inventors: Brian Keith LLOYD, Gregory B. WALZ, Bruce REED, Gregory FITZGERALD, Ayman ISAAC, Kent E. REGNIER, Brandon JANOWIAK, Darian R. SCHULZ, Munawar AHMAD, Eran J. JONES, Javier RESENDEZ, Michael ROST
  • Publication number: 20180006416
    Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.
    Type: Application
    Filed: January 11, 2016
    Publication date: January 4, 2018
    Applicant: Molex, LLC
    Inventors: Brian Keith LLOYD, Gregory B. WALZ, Bruce REED, Gregory FITZGERALD, Ayman ISAAC, Kent E. REGNIER, Bradon JANOWIAK, Darian R. SCHULZ, Munawar AHMAD, Eran J. JONES, Javier RESENDEZ, Michael ROST
  • Publication number: 20170365943
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: August 11, 2017
    Publication date: December 21, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170302011
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: July 5, 2017
    Publication date: October 19, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20170162960
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: February 15, 2017
    Publication date: June 8, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20170125950
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto, to allow signals to be transmitted at greater than 10 GHz with substantially lower loss than a traditional FR4 circuit board.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Applicant: Molex, LLC
    Inventors: Brian Keith Lloyd, Christopher David HIRSCHY, Munawar AHMAD, Eran J. JONES, Stephen W. HAMBLIN, Darian Ross SCHULZ, Todd David WARD, Gregory B. WALZ, Ebrahim ABUNASRAH, Rehan KHAN
  • Patent number: 9608348
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: March 28, 2017
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170033478
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Application
    Filed: October 11, 2016
    Publication date: February 2, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9490558
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 8, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20160268714
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Application
    Filed: May 23, 2016
    Publication date: September 15, 2016
    Applicant: Molex, LLC
    Inventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9362678
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 7, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20160111825
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Application
    Filed: December 17, 2015
    Publication date: April 21, 2016
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9257794
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: February 9, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20150357761
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
    Type: Application
    Filed: August 18, 2015
    Publication date: December 10, 2015
    Applicant: Molex Incorporated
    Inventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST