Patents by Inventor Brian Kirk
Brian Kirk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180056456Abstract: A cooling system which achieves temperature control of a heat affected portion of a pipe.Type: ApplicationFiled: September 1, 2016Publication date: March 1, 2018Inventors: Marcus JANES, Jared PROEGLER, Brian KIRK
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Publication number: 20180062323Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: August 22, 2017Publication date: March 1, 2018Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 9905975Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.Type: GrantFiled: January 22, 2015Date of Patent: February 27, 2018Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., Brian Kirk, David Levine, Vysakh Sivarajan
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Patent number: 9780493Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that has multiple contact surface. The mating contact portion has multiple segments, each with a contact surface, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Such a mating contact may have parallel elongated members on which the mating surface are positioned, providing for the possibility of more than two contact surface per mating contact portion. The mating contact surfaces may be positioned on the elongated members such that the points of contact are at different distances from the distal end of the mating contact portion.Type: GrantFiled: July 15, 2014Date of Patent: October 3, 2017Assignee: Amphenol CorporationInventors: Thomas S. Cohen, Trent K. Do, Brian Kirk
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Patent number: 9705255Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground.Type: GrantFiled: November 20, 2015Date of Patent: July 11, 2017Assignee: Amphenol CorporationInventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
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Publication number: 20160344141Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material may be selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.Type: ApplicationFiled: January 22, 2015Publication date: November 24, 2016Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., Brian Kirk, David Levine, Vysakh Sivarajan
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Patent number: 9440961Abstract: The present invention relates to inhibitors of ROCK1 and ROCK2 and methods of modulating the pharmacokinetic and/or pharmacodynamic properties of such compounds. Also provided are methods of inhibiting ROCK1 and or ROCK2 that are useful for the treatment of disease.Type: GrantFiled: December 23, 2014Date of Patent: September 13, 2016Assignee: SURFACE LOGIX, INC.Inventors: Alessandra Bartolozzi, Stewart Campbell, Hope Foudoulakis, Brian Kirk, Siya Ram, Paul Sweetnam, Hemalatha Seshadri
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Publication number: 20160149343Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.Type: ApplicationFiled: November 20, 2015Publication date: May 26, 2016Applicant: Amphenol CorporationInventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
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Patent number: 9219335Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.Type: GrantFiled: August 28, 2014Date of Patent: December 22, 2015Assignee: Amphenol CorporationInventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
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Publication number: 20150344464Abstract: The present invention relates to inhibitors of ROCK1 and ROCK2 and methods of modulating the pharmacokinetic and/or pharmacodynamic properties of such compounds. Also provided are methods of inhibiting ROCK1 and or ROCK2 that are useful for the treatment of disease.Type: ApplicationFiled: December 23, 2014Publication date: December 3, 2015Inventors: ALESSANDRA BARTOLOZZI, STEWART CAMPBELL, HOPE FOUDOULAKIS, BRIAN KIRK, SIYA RAM, PAUL SWEETNAM
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Patent number: 9028281Abstract: Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.Type: GrantFiled: November 12, 2010Date of Patent: May 12, 2015Assignee: Amphenol CorporationInventors: Brian Kirk, Vijay Kasturi
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Patent number: 9017114Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that generates contact force as it is compressed against a wall of the connector housing. The mating contact portion has multiple segments, each with a contact region extending from the wall, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Additionally, each signal path through the mating interface portions of the connectors can be narrow and has a relatively uniform cross section to provide a uniform impedance. Additional size reduction may be achieved by mounting a ground contact on an exterior surface of a connector housing in alternating rows. Additionally, embodiments in which a wavy contact is used in a cantilevered configuration are also described.Type: GrantFiled: August 29, 2013Date of Patent: April 28, 2015Assignee: Amphenol CorporationInventors: Thomas S. Cohen, Trent K. Do, Brian Kirk
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Publication number: 20150056856Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.Type: ApplicationFiled: August 28, 2014Publication date: February 26, 2015Applicant: Amphenol CorporationInventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
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Patent number: 8926377Abstract: Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.Type: GrantFiled: November 12, 2010Date of Patent: January 6, 2015Assignee: Amphenol CorporationInventors: Brian Kirk, Vijay Kasturi
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Patent number: 8924621Abstract: An apparatus and method for a Universal Serial Bus (USB) isolating device. An USB isolating device includes a downstream facing circuit and a upstream facing circuit. The downstream facing circuit is coupled to a peripheral device via a first pair of signals and is configured for detecting a speed at which the peripheral device is operating based on a first voltage configuration on the first pair of signals. The upstream facing circuit is coupled to the downstream facing circuit and a host/hub via a second pair of signals and is configured for communicating with the downstream facing circuit on the speed of the peripheral device and adaptively creating a second voltage configuration on the second pair of signals to facilitate the host/hub to adapt to the speed of the peripheral device.Type: GrantFiled: November 5, 2010Date of Patent: December 30, 2014Assignee: Linear Technology CorporationInventor: Brian Kirk Jadus
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Patent number: 8916576Abstract: The present invention relates to inhibitors of ROCK1 and ROCK2 and methods of modulating the pharmacokinetic and/or pharmacodynamic properties of such compounds. Also provided are methods of inhibiting ROCK1 and or ROCK2 that are useful for the treatment of disease.Type: GrantFiled: December 14, 2012Date of Patent: December 23, 2014Assignee: Surface Logix, Inc.Inventors: Alessandra Bartolozzi, Stewart Campbell, Hope Foudoulakis, Brian Kirk, Siya Ram, Paul Sweetnam, Hemalatha Seshadri
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Publication number: 20140329414Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that has multiple contact surface. The mating contact portion has multiple segments, each with a contact surface, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Such a mating contact may have parallel elongated members on which the mating surface are positioned, providing for the possibility of more than two contact surface per mating contact portion. The mating contact surfaces may be positioned on the elongated members such that the points of contact are at different distances from the distal end of the mating contact portion.Type: ApplicationFiled: July 15, 2014Publication date: November 6, 2014Applicant: Amphenol CorporationInventors: Thomas S. Cohen, Trent K. Do, Brian Kirk
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Patent number: D812013Type: GrantFiled: May 5, 2016Date of Patent: March 6, 2018Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis
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Patent number: D812568Type: GrantFiled: April 12, 2016Date of Patent: March 13, 2018Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis
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Patent number: D812569Type: GrantFiled: May 5, 2016Date of Patent: March 13, 2018Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis