Patents by Inventor Brian Kirk

Brian Kirk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180056456
    Abstract: A cooling system which achieves temperature control of a heat affected portion of a pipe.
    Type: Application
    Filed: September 1, 2016
    Publication date: March 1, 2018
    Inventors: Marcus JANES, Jared PROEGLER, Brian KIRK
  • Publication number: 20180062323
    Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.
    Type: Application
    Filed: August 22, 2017
    Publication date: March 1, 2018
    Applicant: Amphenol Corporation
    Inventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
  • Patent number: 9905975
    Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material is selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: February 27, 2018
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, Donald A. Girard, Jr., Brian Kirk, David Levine, Vysakh Sivarajan
  • Patent number: 9780493
    Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that has multiple contact surface. The mating contact portion has multiple segments, each with a contact surface, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Such a mating contact may have parallel elongated members on which the mating surface are positioned, providing for the possibility of more than two contact surface per mating contact portion. The mating contact surfaces may be positioned on the elongated members such that the points of contact are at different distances from the distal end of the mating contact portion.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: October 3, 2017
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Trent K. Do, Brian Kirk
  • Patent number: 9705255
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: July 11, 2017
    Assignee: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Publication number: 20160344141
    Abstract: A modular electrical connector with broad-side coupled signal conductors in a right angle intermediate portion and edge coupled end portions. Broadside coupling provides balanced pairs for very high frequency operation, while edge coupling provides a high density interconnection system at low cost. Each module has separately shielded signal conductor pairs. The shielding is shaped to avoid or suppress undesirable propagation modes within an enclosure formed by shielding per module. Lossy material may be selectively placed within and outside the shielding per module to likewise avoid or suppress unwanted signal propagation.
    Type: Application
    Filed: January 22, 2015
    Publication date: November 24, 2016
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., Brian Kirk, David Levine, Vysakh Sivarajan
  • Patent number: 9440961
    Abstract: The present invention relates to inhibitors of ROCK1 and ROCK2 and methods of modulating the pharmacokinetic and/or pharmacodynamic properties of such compounds. Also provided are methods of inhibiting ROCK1 and or ROCK2 that are useful for the treatment of disease.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: September 13, 2016
    Assignee: SURFACE LOGIX, INC.
    Inventors: Alessandra Bartolozzi, Stewart Campbell, Hope Foudoulakis, Brian Kirk, Siya Ram, Paul Sweetnam, Hemalatha Seshadri
  • Publication number: 20160149343
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Application
    Filed: November 20, 2015
    Publication date: May 26, 2016
    Applicant: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Patent number: 9219335
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: December 22, 2015
    Assignee: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Publication number: 20150344464
    Abstract: The present invention relates to inhibitors of ROCK1 and ROCK2 and methods of modulating the pharmacokinetic and/or pharmacodynamic properties of such compounds. Also provided are methods of inhibiting ROCK1 and or ROCK2 that are useful for the treatment of disease.
    Type: Application
    Filed: December 23, 2014
    Publication date: December 3, 2015
    Inventors: ALESSANDRA BARTOLOZZI, STEWART CAMPBELL, HOPE FOUDOULAKIS, BRIAN KIRK, SIYA RAM, PAUL SWEETNAM
  • Patent number: 9028281
    Abstract: Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: May 12, 2015
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Vijay Kasturi
  • Patent number: 9017114
    Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that generates contact force as it is compressed against a wall of the connector housing. The mating contact portion has multiple segments, each with a contact region extending from the wall, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Additionally, each signal path through the mating interface portions of the connectors can be narrow and has a relatively uniform cross section to provide a uniform impedance. Additional size reduction may be achieved by mounting a ground contact on an exterior surface of a connector housing in alternating rows. Additionally, embodiments in which a wavy contact is used in a cantilevered configuration are also described.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: April 28, 2015
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Trent K. Do, Brian Kirk
  • Publication number: 20150056856
    Abstract: An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.
    Type: Application
    Filed: August 28, 2014
    Publication date: February 26, 2015
    Applicant: Amphenol Corporation
    Inventors: Prescott B. Atkinson, Brian Kirk, Mark W. Gailus, David Manter, Thomas S. Cohen
  • Patent number: 8926377
    Abstract: Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: January 6, 2015
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Vijay Kasturi
  • Patent number: 8924621
    Abstract: An apparatus and method for a Universal Serial Bus (USB) isolating device. An USB isolating device includes a downstream facing circuit and a upstream facing circuit. The downstream facing circuit is coupled to a peripheral device via a first pair of signals and is configured for detecting a speed at which the peripheral device is operating based on a first voltage configuration on the first pair of signals. The upstream facing circuit is coupled to the downstream facing circuit and a host/hub via a second pair of signals and is configured for communicating with the downstream facing circuit on the speed of the peripheral device and adaptively creating a second voltage configuration on the second pair of signals to facilitate the host/hub to adapt to the speed of the peripheral device.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: December 30, 2014
    Assignee: Linear Technology Corporation
    Inventor: Brian Kirk Jadus
  • Patent number: 8916576
    Abstract: The present invention relates to inhibitors of ROCK1 and ROCK2 and methods of modulating the pharmacokinetic and/or pharmacodynamic properties of such compounds. Also provided are methods of inhibiting ROCK1 and or ROCK2 that are useful for the treatment of disease.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: December 23, 2014
    Assignee: Surface Logix, Inc.
    Inventors: Alessandra Bartolozzi, Stewart Campbell, Hope Foudoulakis, Brian Kirk, Siya Ram, Paul Sweetnam, Hemalatha Seshadri
  • Publication number: 20140329414
    Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that has multiple contact surface. The mating contact portion has multiple segments, each with a contact surface, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Such a mating contact may have parallel elongated members on which the mating surface are positioned, providing for the possibility of more than two contact surface per mating contact portion. The mating contact surfaces may be positioned on the elongated members such that the points of contact are at different distances from the distal end of the mating contact portion.
    Type: Application
    Filed: July 15, 2014
    Publication date: November 6, 2014
    Applicant: Amphenol Corporation
    Inventors: Thomas S. Cohen, Trent K. Do, Brian Kirk
  • Patent number: D812013
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: March 6, 2018
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis
  • Patent number: D812568
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: March 13, 2018
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis
  • Patent number: D812569
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: March 13, 2018
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis