Brian Klinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.
Type:
Grant
Filed:
February 6, 2013
Date of Patent:
August 22, 2017
Assignee:
TE CONNECTIVITY CORPORATION
Inventors:
Chong Hun Yi, Andrew Dewitt Balthaser, Brian Klinger, Matt Richard McAlonis, Keith Miller
Abstract: A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.
Type:
Application
Filed:
February 6, 2013
Publication date:
August 7, 2014
Applicant:
Tyco Electronics Corporation
Inventors:
CHONG HUN YI, Andrew Dewitt Balthaser, Brian Klinger, Matt Richard McAlonis, Keith Miller