Patents by Inventor Brian L. Bex

Brian L. Bex has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier
    Patent number: 7196009
    Abstract: A method of fabricating a lapping carrier is provided that includes the steps of defining at least one opening extending through a workpiece that is sized to receive a wafer, and cryogenically tempering the workpiece to produce a lapping carrier. By cryogenically tempering the workpiece, the conversion of the crystalline structure of the workpiece to a martensite crystalline structure is enhanced, thereby improving the hardness of the lapping carrier. A lapping carrier is also provided that has a crystalline structure, of which at least 70% is a martensite crystalline structure. An apparatus for lapping a wafer is further provided that includes a hardened lapping carrier and at least one lapping plate proximate the lapping carrier for lapping wafer(s) disposed within the at least one opening defined by the lapping carrier.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: March 27, 2007
    Assignee: SEH America, Inc.
    Inventors: Brian L. Bex, David K. Chen
  • Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier
    Publication number: 20040224522
    Abstract: A method of fabricating a lapping carrier is provided that includes the steps of defining at least one opening extending through a workpiece that is sized to receive a wafer, and cryogenically tempering the workpiece to produce a lapping carrier. By cryogenically tempering the workpiece, the conversion of the crystalline structure of the workpiece to a martensite crystalline structure is enhanced, thereby improving the hardness of the lapping carrier. A lapping carrier is also provided that has a crystalline structure, of which at least 70% is a martensite crystalline structure. An apparatus for lapping a wafer is further provided that includes a hardened lapping carrier and at least one lapping plate proximate the lapping carrier for lapping wafer(s) disposed within the at least one opening defined by the lapping carrier.
    Type: Application
    Filed: May 9, 2003
    Publication date: November 11, 2004
    Applicant: SEH America, Inc.
    Inventors: Brian L. Bex, David K. Chen