Abstract: A wireless switch comprises a mechanical switch and a transmitter. The transmitter transmits information in the event that the mechanical switch is switched, wherein the transmitter is powered by the mechanical switch being switched.

Abstract: A wireless switch comprises a mechanical oscillator, a mechanical impulse deliverer, a first array of magnets positioned on a planar surface, a first conductor, and a power management circuit. The mechanical impulse deliverer delivers a mechanical impulse to the mechanical oscillator when the wireless switch is switched. The first array comprises a one dimensional or two dimensional array of magnets. The first conductor comprises a first serpentine conductor. The power management circuit provides DC power as a result of relative motion due to the mechanical oscillator between the first array of magnets and the first conductor.

Abstract: A wireless switch comprises a mechanical oscillator, a mechanical impulse deliverer, a first array of magnets positioned on a planar surface, a first conductor, and a power management circuit. The mechanical impulse deliverer delivers a mechanical impulse to the mechanical oscillator when the wireless switch is switched. The first array comprises a one dimensional or two dimensional array of magnets. The first conductor comprises a first serpentine conductor. The power management circuit provides DC power as a result of relative motion due to the mechanical oscillator between the first array of magnets and the first conductor.

Abstract: A wireless switch comprises a mechanical oscillator, a mechanical impulse deliverer, a first array of magnets positioned on a planar surface, a first conductor, and a power management circuit. The mechanical impulse deliverer delivers a mechanical impulse to the mechanical oscillator when the wireless switch is switched. The first array comprises a one dimensional or two dimensional array of magnets. The first conductor comprises a first serpentine conductor. The power management circuit provides DC power as a result of relative motion due to the mechanical oscillator between the first array of magnets and the first conductor.

Abstract: A MEMS resonater employs a bulk longitudinal resonating mass supported by opposing tethers above a substrate with primary capacitive plates spaced from end surfaces of the resonating mass and supported on the substrate. Any number of secondary capacitive plates can be spaced from side surfaces of the resonating mass for detecting transverse vibrations. The secondary capacitive plates can be shaped to conform to the mode of the transverse vibration. The sensor is readily fabricated using a two-mask self-aligned process, or a one-mask self-aligned process with timed etch.

Abstract: A MEMS resonator includes an annular resonator body defined by an inner radius and an outer radius, a first electrode positioned within the inner radius and spaced from the resonator body, and a second electrode positioned around the annular resonator body and spaced from the outer radius. The first electrode and the second electrode provide for capacitive drive of the resonator body and capacitive sense of the resonator body. Piezo-resistive sense and piezoelectric drive/sense techniques can also be utilized. The overall extent can be smaller than 1 cm2 in area and positioned on a supporting substrate by a plurality of anchors. The substrate can comprise an RF transceiver integrated circuit with the anchors connecting the drive electrode and sense electrode to the integrated circuit. The resonator is readily fabricated using conventional semiconductor integrated circuit fabrication techniques.

Abstract: A MEMS resonator includes an annular resonator body defined by an inner radius and an outer radius, a first electrode positioned within the inner radius and spaced from the resonator body, and a second electrode positioned around the annular resonator body and spaced from the outer radius. The first electrode and the second electrode provide for capacitive drive of the resonator body and capacitive sense of the resonator body. Piezo-resistive sense and piezoelectric drive/sense techniques can also be utilized. The overall extant can be smaller than 1 cm2 in area and positioned on a supporting substrate by a plurality of anchors. The substrate can comprise an RF transceiver integrated circuit with the anchors connecting the drive electrode and sense electrode to the integrated circuit. The resonator is readily fabricated using conventional semiconductor integrated circuit fabrication techniques.

Abstract: A MEMS resonator employs a bulk longitudinal resonating mass supported by opposing tethers above a substrate with primary capacitive plates spaced from end surfaces of the resonating mass and supported on the substrate. Any number of secondary capacitive plates can be spaced from side surfaces of the resonating mass for detecting transverse vibrations. The secondary capacitive plates can be shaped to conform to the mode of the transverse vibration. The resonator is readily fabricated using a two-mask self-aligned process, or a one-mask self-aligned process with timed etch.