Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Cable structures of security systems may include multiple subassemblies having different cut-resistant characteristics. One system includes, inter alia, a portable article, a support, and a length of a cable assembly extending between a first cable end coupled to the portable article and a second cable end coupled to the support, where the cable assembly includes a first cable subassembly extending along at least a portion of the length of the cable assembly, and a second cable subassembly extending along at least the portion of the length of the cable assembly and adjacent to the first cable subassembly, and where the first cable subassembly includes a first cut resistant characteristic and the second cable subassembly includes a second cut resistant characteristic that is different than the first cut resistant characteristic.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Cable structures of security systems may include multiple subassemblies having different cut-resistant characteristics. One system includes, inter alia, a portable article, a support, and a length of a cable assembly extending between a first cable end coupled to the portable article and a second cable end coupled to the support, where the cable assembly includes a first cable subassembly extending along at least a portion of the length of the cable assembly, and a second cable subassembly extending along at least the portion of the length of the cable assembly and adjacent to the first cable subassembly, and where the first cable subassembly includes a first cut resistant characteristic and the second cable subassembly includes a second cut resistant characteristic that is different than the first cut resistant characteristic.

Abstract: Cable structures of security systems may include multiple subassemblies having different cut-resistant characteristics. One system includes, inter alia, a portable article, a support, and a length of a cable assembly extending between a first cable end coupled to the portable article and a second cable end coupled to the support, where the cable assembly includes a first cable subassembly extending along at least a portion of the length of the cable assembly, and a second cable subassembly extending along at least the portion of the length of the cable assembly and adjacent to the first cable subassembly, and where the first cable subassembly includes a first cut resistant characteristic and the second cable subassembly includes a second cut resistant characteristic that is different than the first cut resistant characteristic.

Abstract: Cable structures with multiple subassemblies having different cut-resistant characteristics and systems and methods for making the same are provided.