Patents by Inventor Brian L. DeFord

Brian L. DeFord has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly having angled spring portions
    Patent number: 7121838
    Abstract: An electronic assembly is provided, having a plurality of spring elements interconnecting corresponding terminals of first and second arrays of terminals on first and second electronic devices. The arrays have rows and columns extending in x- and y-directions, respectively. Each spring element has a cantilever portion extending diagonally in the x- and y-directions between corresponding terminals of the first and second arrays.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: October 17, 2006
    Assignee: Intel Corporation
    Inventors: Brian L. DeFord, Donald T. Tran
  • Electronic assembly having a socket with a support plane
    Patent number: 6899549
    Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: May 31, 2005
    Assignee: Intel Corporation
    Inventor: Brian L. DeFord
  • Electronic assembly having a socket with features that ensure alignment in X- and Y-directions of a component held thereby
    Patent number: 6848936
    Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: February 1, 2005
    Assignee: Intel Corporation
    Inventor: Brian L. DeFord
  • Electronic assembly having a socket with a support plane
    Publication number: 20040242028
    Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.
    Type: Application
    Filed: May 27, 2003
    Publication date: December 2, 2004
    Inventor: Brian L. DeFord
  • ELECTRONIC ASSEMBLY HAVING A SOCKET WITH FEATURES THAT ENSURE ALIGNMENT IN X- AND Y-DIRECTIONSOF A COMPONENT HELD THEREBY
    Publication number: 20040242057
    Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.
    Type: Application
    Filed: May 27, 2003
    Publication date: December 2, 2004
    Inventor: Brian L. DeFord
  • Electronic assembly having angled spring portions
    Publication number: 20040203261
    Abstract: An electronic assembly is provided, having a plurality of spring elements interconnecting corresponding terminals of first and second arrays of terminals on first and second electronic devices. The arrays have rows and columns extending in x- and y-directions, respectively. Each spring element has a cantilever portion extending diagonally in the x- and y-directions between corresponding terminals of the first and second arrays.
    Type: Application
    Filed: April 9, 2003
    Publication date: October 14, 2004
    Inventors: Brian L. DeFord, Donald T. Tran