Patents by Inventor Brian L. Mueller

Brian L. Mueller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190249395
    Abstract: A work machine having a cab coupled to a frame, a steering system coupled to the frame, a controller configured to selectively articulate the steering system, a joystick assembly positioned in the cab and in communication with the controller, a steering wheel assembly positioned in the cab and configured to selectively articulate the steering system, and a steering wheel sensor coupled to the steering wheel assembly and in communication with the controller to identify movement of the steering wheel assembly. Wherein, the controller does not articulate the steering system responsive to movement of the joystick assembly when the steering wheel sensor identifies movement of the steering wheel.
    Type: Application
    Filed: February 13, 2018
    Publication date: August 15, 2019
    Inventors: David J. Myers, Brian K. Kellogg, Aaron R. Kenkel, Adam J. Sobkowiak, Michael McCabe, Bryan J. Huttenlocher, Jason L. Mueller
  • Publication number: 20180100097
    Abstract: A composition comprising an alcohol ether sulfonate and a quaternary ammonium salt is provided for use in methods of increasing recovery of crude oil from a subterranean hydrocarbon-containing formation.
    Type: Application
    Filed: December 12, 2017
    Publication date: April 12, 2018
    Inventors: Duy T. Nguyen, Brian L. Mueller
  • Patent number: 9926486
    Abstract: A composition comprising an alcohol ether sulfonate and a quaternary ammonium salt is provided for use in methods of increasing recovery of crude oil from a subterranean hydrocarbon-containing formation.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: March 27, 2018
    Assignee: Ecolab USA Inc.
    Inventors: Duy T. Nguyen, Brian L. Mueller
  • Patent number: 9404033
    Abstract: Processes are provided for reducing the hydrodynamic friction of a turbulent brine stream including, for example, the step of injecting a mixture of a finely divided free flowing friction reducing powder into the turbulent brine stream, wherein the particles of the powder have a primary particle size between 10 and 100 microns in average particle diameter, and the brine stream comprises water with at least 90,000 ppm total dissolved solids, wherein the total dissolved solids includes at least 30,000 ppm sodium cations, 10,000 ppm calcium cations, and 1,000 ppm magnesium cations, and wherein the brine has an electrical conductivity of greater than 100.0 mS/cm at 25° C. For use with a harsher brine, the particles preferably have a primary particle size between 10 and 53 microns in average particle diameter. The friction reducing powder may, for example, be a polyacrylamide polymer.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: August 2, 2016
    Assignee: Ecolab USA Inc.
    Inventors: Houston P. Perry, Brian L. Mueller
  • Publication number: 20150275634
    Abstract: A composition comprising an alcohol ether sulfonate and a quaternary ammonium salt is provided for use in methods of increasing recovery of crude oil from a subterranean hydrocarbon-containing formation.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 1, 2015
    Applicant: ECOLAB USA INC.
    Inventors: Duy T. Nguyen, Brian L. Mueller
  • Publication number: 20140051610
    Abstract: Processes are provided for reducing the hydrodynamic friction of a turbulent brine stream including, for example, the step of injecting a mixture of a finely divided free flowing friction reducing powder into the turbulent brine stream, wherein the particles of the powder have a primary particle size between 10 and 100 microns in average particle diameter, and the brine stream comprises water with at least 90,000 ppm total dissolved solids, wherein the total dissolved solids includes at least 30,000 ppm sodium cations, 10,000 ppm calcium cations, and 1,000 ppm magnesium cations, and wherein the brine has an electrical conductivity of greater than 100.0 mS/cm at 25° C. For use with a harsher brine, the particles preferably have a primary particle size between 10 and 53 microns in average particle diameter. The friction reducing powder may, for example, be a polyacrylamide polymer.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 20, 2014
    Applicant: CORSICANA TECHNOLOGIES, INC.
    Inventors: Houston P. Perry, Brian L. Mueller
  • Publication number: 20120264655
    Abstract: Polymers and hydrogels that are provided that are thermo-responsive, such as thermo-thickening polymers and hydrogels, as well as aqueous solutions whose rheological properties may be modified by including the polymers, hydrogels, or combinations thereof. Such thermo-responsive polymers or hydrogels, or aqueous solutions including the polymers or hydrogels, may be used as additives to reservoir drilling fluids (RDF's), fluid loss control (FLC) pills, hydraulic fracturing fluids (frac fluids), and lost circulation (LC) pills. The polymers or hydrogels may impart a rheological profile that is generally flat with respect to variations in the shear-rate and temperature environment in which drilling fluids, RDF's, FLC pills, frac fluids, and LC pills are deployed. Embodiments include the process of producing a high performance filtercake through the application of thermo-responsive hydrogels and/or thermo-responsive polymer solutions.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 18, 2012
    Applicant: CORSICANA TECHNOLOGIES, INC.
    Inventors: Shawn Fitch, Robert L. Horton, Brian L. Mueller
  • Patent number: 8268135
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: September 18, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N Korovin, Brian L Mueller
  • Patent number: 7365013
    Abstract: A system, composition, and a method for planarizing or polishing a composite substrate are provided. The planarizing or polishing system comprises (i) a polishing composition comprising (a) about 0.5 wt. % or more of fluoride ions, (b) about 1 wt. % or more of an amine, (c) about 0.1 wt. % or more of a base, and (d) water, and (ii) an abrasive. The present invention also provides a method of planarizing or polishing a composite substrate comprising contacting the substrate with a system comprising (i) a polishing composition comprising (a) about 0.5 wt. % or more of fluoride ions, (b) about 1 wt. % or more of an amine, (c) about 0.1 wt. % or more of a base, and (d) water, and (ii) an abrasive.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: April 29, 2008
    Assignee: Cabot Microelectronics Corporation
    Inventors: Brian L. Mueller, Jeffery P. Chamberlain, David J. Schroeder
  • Patent number: 7297633
    Abstract: The present invention provides a method of manufacturing a composition for polishing silica and silicon nitride on a semiconductor substrate. The method comprises ion-exchanging carboxylic acid polymer to reduce ammonia and combining by weight percent 0.01 to 5 of the ion-exchanged carboxylic acid polymer with 0.001 to 1 quaternary ammonium compound, 0.001 to 1 phthalic acid and salts thereof, 0.01 to 5 abrasive, and balance water.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: November 20, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Brian L. Mueller
  • Patent number: 7291280
    Abstract: The present invention provides a method for polishing silica and silicon nitride on a semiconductor wafer comprising the steps of planarizing the silica with a first aqueous composition comprising by weight percent 0.01 to 5 carboxylic acid polymer, 0.02 to 6 abrasive, 0.01 to 10 polyvinylpyrrolidone, 0 to 5 cationic compound, 0 to 1 phthalic acid and salts, 0 to 5 zwitterionic compound and balance water, wherein the polyvinylpyrrolidone has an average molecular weight between 100 grams/mole to 1,000,000 grams/mole. The method further provides detecting an endpoint to the planarization, and clearing the silica with a second aqueous composition comprising by weight percent 0.001 to 1 quaternary ammonium compound, 0.001 to 1 phthalic acid and salts thereof, 0.01 to 5 carboxylic acid polymer, 0.01 to 5 abrasive and balance water.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: November 6, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Sarah J. Lane, Andrew Scott Lawing, Brian L. Mueller, Charles Yu
  • Patent number: 7238618
    Abstract: A system, composition, and a method for planarizing or polishing a composite substrate are provided. The planarizing or polishing system comprises (i) a polishing composition comprising (a) about 0.5 wt. % or more of fluoride 5 ions, (b) about 1 wt. % or more of an amine, (c) about 0.1 wt. % or more of a base, and (d) water, and (ii) an abrasive. The present invention also provides a method of planarizing or polishing a composite substrate comprising contacting the substrate with a system comprising (i) a polishing composition comprising (a) about 0.5 wt. % or more of fluoride ions, (b) about 1 wt. % or more of an amine, (c) about 0.1 wt. % or more of a base, and (d) water, and (ii) an abrasive.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: July 3, 2007
    Assignee: Cabot Microelectronics Corporation
    Inventors: Brian L. Mueller, Jeffery P. Chamberlain, David J. Schroeder
  • Patent number: 6984588
    Abstract: A chemical mechanical polishing composition comprising a soluble cerium compound at a pH above 3 and a method to selectively polish a silicon oxide overfill in preference to a silicon nitride film layer in a single step during the manufacture of integrated circuits and semiconductors.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: January 10, 2006
    Assignee: Cabot Microelectronics Corporation
    Inventors: Gautam S. Grover, Brian L. Mueller, Shumin Wang
  • Patent number: 6974525
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: December 13, 2005
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N. Korovin, Brian L. Mueller
  • Patent number: 6849547
    Abstract: A process for removing a metallized surface from a workpiece is provided. A kinetic removal mechanism for removal of the metallized surface is characterized by a formation step for formation of a removable surface film and an abrasive step for removal of the film. The process includes causing the workpiece to contact a polishing surface while effecting relative motion between the workpiece and the polishing surface. The process also includes causing a polishing solution having less than 1 wt % of a polishing abrasive to be distributed at a contact area between the workpiece and the polishing surface so that the abrasive step is a rate-determining step of the removal mechanism.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: February 1, 2005
    Assignee: SpeedFam IPEC Corporation
    Inventors: Saket Chadda, Ismail Emesh, Brian L. Mueller
  • Publication number: 20040195110
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Application
    Filed: May 17, 2004
    Publication date: October 7, 2004
    Applicant: SPEEDFAM-IPEC CORPORATION
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N. Korovin, Brian L. Mueller
  • Patent number: 6736952
    Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: May 18, 2004
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Ismail Emesh, Saket Chadda, Nikolay N. Korovin, Brian L. Mueller
  • Publication number: 20040089634
    Abstract: A chemical mechanical polishing composition comprising a soluble cerium compound at a pH above 3 and a method to selectively polish a silicon oxide overfill in preference to a silicon nitride film layer in a single step during the manufacture of integrated circuits and semiconductors.
    Type: Application
    Filed: October 27, 2003
    Publication date: May 13, 2004
    Applicant: Cabot Microelectronics Corporation
    Inventors: Gautam S. Grover, Brian L. Mueller, Shumin Wang
  • Patent number: 6726534
    Abstract: The invention provides a polishing system that comprises a liquid carrier, an alkali metal ion, hydroxide ions, and a polishing pad and/or an abrasive. The abrasive can be dispersed in the liquid carrier of the polishing system or bound to the polishing pad. The alkali metal ion can be any univalent group I metal ion and is present in the polishing system at a concentration of about 0.05 M or more. Hydroxide ions are present in a sufficient amount to provide the system with a pH of about 9 or more. The liquid carrier of the polishing system can be any suitable polar solvent, such as water. The invention further provides a polishing method that involves polishing a portion of a substrate with the polishing system beginning about 6 hours or less after the polishing system is prepared.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: April 27, 2004
    Assignee: Cabot Microelectronics Corporation
    Inventors: Gregory H. Bogush, Jeffrey P. Chamberlain, Paul M. Feeney, Brian L. Mueller, David J. Schroeder, Alicia F. Walters
  • Patent number: 6716755
    Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: April 6, 2004
    Assignee: Cabot Microelectronics Corporation
    Inventors: Mingming Fang, Brian L. Mueller, James A. Dirksen