Patents by Inventor Brian L. Shigekawa

Brian L. Shigekawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ligand gold bonding
    Patent number: 5384073
    Abstract: Gold sol coated with alkanethiols and alkanethiol derivatives, which provide groups on the sol available for the linking of binding moieties such as antibodies, antigens or ligands to the gold sol. Di- and tri-thiol compounds bound to gold sol also facilitate the adsorption of antibodies, antigens or ligands to the sol. The coating process, and test kits incorporating the coated sols are also included.
    Type: Grant
    Filed: January 21, 1994
    Date of Patent: January 24, 1995
    Assignee: AKZO N.V.
    Inventors: Brian L. Shigekawa, Yung-Ao Hsieh
  • Ligand gold bonding
    Patent number: 5294369
    Abstract: Gold sol coated with alkanethiols and alkanethiol derivatives, which provide groups on the sol available for the linking of binding moieties such as antibodies, antigens or ligands to the gold sol. Di- and tri-thiol compounds bound to gold sol also facilitate the adsorption of antibodies, antigens or ligands to the sol. The coating process, and test kits incorporating the coated sols are also included.
    Type: Grant
    Filed: December 5, 1990
    Date of Patent: March 15, 1994
    Assignee: AKZO N.V.
    Inventors: Brian L. Shigekawa, Yung-Ao Hsieh