Patents by Inventor Brian L. STAUFFER
Brian L. STAUFFER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11441826Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, a condenser disposed downstream of the compressor along the refrigerant loop and configured to condense vapor refrigerant to liquid refrigerant, a subcooler coupled to the condenser, where the subcooler is external of a shell of the condenser, and where the subcooler is configured to receive the liquid refrigerant from the condenser and to cool the liquid refrigerant to subcooled refrigerant, and an evaporator disposed downstream of the subcooler along the refrigerant loop and configured to evaporate the subcooled refrigerant to the vapor refrigerant.Type: GrantFiled: April 8, 2021Date of Patent: September 13, 2022Assignee: Johnson Controls Tyco IP Holdings LLPInventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin D. Krebs, Justin P. Kauffman, Brian L. Stauffer, Xiuping Su, Li Wang, Fang Xue
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Publication number: 20210222925Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, a condenser disposed downstream of the compressor along the refrigerant loop and configured to condense vapor refrigerant to liquid refrigerant, a subcooler coupled to the condenser, where the subcooler is external of a shell of the condenser, and where the subcooler is configured to receive the liquid refrigerant from the condenser and to cool the liquid refrigerant to subcooled refrigerant, and an evaporator disposed downstream of the subcooler along the refrigerant loop and configured to evaporate the subcooled refrigerant to the vapor refrigerant.Type: ApplicationFiled: April 8, 2021Publication date: July 22, 2021Inventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin D. Krebs, Justin P. Kauffman, Brian L. Stauffer, Xiuping Su, Li Wang, Fang Xue
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Patent number: 10830510Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, a condenser disposed downstream of the compressor along the refrigerant loop, where the condenser includes a plurality of tubes disposed in a shell and a diffusion area configured to enhance thermal energy transfer within the condenser, where the diffusion area is defined by a cavity of the condenser without a tube of the plurality of tubes, and an evaporator disposed downstream of the condenser along the refrigerant loop.Type: GrantFiled: December 20, 2016Date of Patent: November 10, 2020Assignee: Johnson Controls Technology CompanyInventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin D. Krebs, Justin P. Kauffman, Brian L. Stauffer
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Patent number: 10508843Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, and a heat exchanger disposed along the refrigerant loop and configured to place the refrigerant in a heat exchange relationship with a cooling fluid. The heat exchanger includes a water box portion having a first length, a shell having a second length, a plurality of tubes disposed in the shell and configured to flow the cooling fluid, and a cooling fluid portion having a third length, where the water box portion and the cooling fluid portion are coupled to the shell, such that the first length, the second length, and the third length form a combined length of the heat exchanger that is substantially equal to a target length.Type: GrantFiled: December 20, 2016Date of Patent: December 17, 2019Assignee: Johnson Controls Technology CompanyInventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin D. Krebs, Justin P. Kauffman, Brian L. Stauffer
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Patent number: 10462942Abstract: A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.Type: GrantFiled: May 10, 2017Date of Patent: October 29, 2019Assignee: Johnson Controls Technology CompanyInventors: Konstantin Borisov, Mark A. Nielsen, Jeffrey A. Martinelli, Brian L. Stauffer, Seth K. Gladfelter, Michael S. Todd, Ivan Jadric, Jeb W. Schreiber, Tim Beckley
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Publication number: 20170245402Abstract: A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.Type: ApplicationFiled: May 10, 2017Publication date: August 24, 2017Inventors: Konstantin Borisov, Mark A. Nielsen, Jeffrey A. Martinelli, Brian L. Stauffer, Seth K. Gladfelter, Michael S. Todd, Ivan Jadric, Jeb W. Schreiber, Tim Beckley
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Publication number: 20170176063Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, a condenser disposed downstream of the compressor along the refrigerant loop, where the condenser includes a plurality of tubes disposed in a shell and a diffusion area configured to enhance thermal energy transfer within the condenser, where the diffusion area is defined by a cavity of the condenser without a tube of the plurality of tubes, and an evaporator disposed downstream of the condenser along the refrigerant loop.Type: ApplicationFiled: December 20, 2016Publication date: June 22, 2017Inventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin F. Krebs, Justin P. Kauffman, Brian L. Stauffer
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Publication number: 20170176064Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, and a heat exchanger disposed along the refrigerant loop and configured to place the refrigerant in a heat exchange relationship with a cooling fluid. The heat exchanger includes a water box portion having a first length, a shell having a second length, a plurality of tubes disposed in the shell and configured to flow the cooling fluid, and a cooling fluid portion having a third length, where the water box portion and the cooling fluid portion are coupled to the shell, such that the first length, the second length, and the third length form a combined length of the heat exchanger that is substantially equal to a target length.Type: ApplicationFiled: December 20, 2016Publication date: June 22, 2017Inventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin F. Krebs, Justin P. Kauffman, Brian L. Stauffer
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Publication number: 20170176066Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, a condenser disposed downstream of the compressor along the refrigerant loop and configured to condense vapor refrigerant to liquid refrigerant, a subcooler coupled to the condenser, where the subcooler is external of a shell of the condenser, and where the subcooler is configured to receive the liquid refrigerant from the condenser and to cool the liquid refrigerant to sub cooled refrigerant, and an evaporator disposed downstream of the subcooler along the refrigerant loop and configured to evaporate the subcooled refrigerant to the vapor refrigerant.Type: ApplicationFiled: December 20, 2016Publication date: June 22, 2017Inventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin F. Krebs, Justin P. Kauffman, Brian L. Stauffer, Xiuping Su, Li Wang, Fang Xue
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Patent number: 9654017Abstract: A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.Type: GrantFiled: December 8, 2015Date of Patent: May 16, 2017Assignee: Johnson Controls Technology CompanyInventors: Konstantin Borisov, Mark A. Nielsen, Jeffrey A. Martinelli, Brian L. Stauffer, Seth K. Gladfelter, Michael S. Todd, Ivan Jadric, Jeb W. Schreiber, Tim Beckley
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Publication number: 20160165762Abstract: A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.Type: ApplicationFiled: December 8, 2015Publication date: June 9, 2016Inventors: Konstantin BORISOV, Mark A. NIELSEN, Jeffrey A. MARTINELLI, Brian L. STAUFFER, Seth K. GLADFELTER, Michael S. TODD, Ivan JADRIC, Jeb W. SCHREIBER, Tim BECKLEY