Patents by Inventor Brian LABOMBARD

Brian LABOMBARD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260196398
    Abstract: Techniques are described for improving quench damage resiliency in non-insulated (NI) high temperature superconductor (HTS) magnets. The techniques may include tuning an amount of HTS tape within turns of a winding of an NI-HTS magnet to reduce variation in critical current across the winding, and/or may include adjusting the turn-to-turn resistance of the windings by adjusting turn-to-turn spacing between windings and thereby reduce variations in joule heating between turns during a quench.
    Type: Application
    Filed: November 28, 2023
    Publication date: July 9, 2026
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LABOMBARD, Krishna Kiran Kumar UPPALAPATI, Akhdiyor Israilovich SATTAROV
  • Publication number: 20260094751
    Abstract: Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.
    Type: Application
    Filed: January 27, 2025
    Publication date: April 2, 2026
    Applicant: Massachusetts Institute of Technology
    Inventors: Brian LABOMBARD, William BECK, Theodore MOURATIDIS
  • Patent number: 12555711
    Abstract: Techniques are described for lowering strains applied to superconducting material in a superconducting magnet by arranging structural partitions between turns of the superconducting material that intercept and transfer strain to a mechanically stronger structure, such as the housing of the magnet. A structural partition may be formed with a feedthrough slit so that the superconducting material can easily pass through the partition. A number of structural partitions may be interspersed between groups of turns of superconducting material in a magnet so that forces can be sufficiently distributed by the partitions throughout the magnet. At the same time, the number of structural partitions may be selected to minimize the amount of space within the magnet occupied by the partitions that could otherwise be occupied by current-carrying superconducting material.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: February 17, 2026
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Alexey Radovinsky, Alexander Zhukovsky, Nicholas J. Kelton, Sergey Kuznetsov, Daniel Nash, Charlie Sanabria, Brian Labombard, Daniel Brunner, Grant William Kristofek
  • Publication number: 20250226136
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: March 31, 2025
    Publication date: July 10, 2025
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Publication number: 20250182913
    Abstract: Some aspects relate to a toroidal field (TF) coil for a tokamak. The TF coil includes a first inner leg having teeth on a side of the first inner leg. The corresponds to an interface between the TF coil and a second TF coil. The teeth extend along a direction having a component in a radial direction of the tokamak. The teeth are configured to mechanically engage with second teeth of a second inner leg of the second TF coil.
    Type: Application
    Filed: January 20, 2023
    Publication date: June 5, 2025
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LaBombard, Alexey Radovinsky, Daniel Brunner, Christopher J. Lammi, Robert Mumgaard, Nicoli Ames, Frank Kan, Valeria Riccardo, Edwin Bolz
  • Patent number: 12293871
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: September 28, 2023
    Date of Patent: May 6, 2025
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Patent number: 12243682
    Abstract: Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: March 4, 2025
    Assignee: Massachusetts Institute of Technology
    Inventors: Brian Labombard, William Beck, Theodore Mouratidis
  • Publication number: 20240420875
    Abstract: Described are concepts, systems, structures and techniques for metal filling an open channel (12) in a baseplate (19). In embodiments, metal filling of an open baseplate channel is achieved using vacuum pressure impregnation (VPI). In embodiments, a compression plate (14a) is disposed over an open baseplate channel (12) to be filled with a molten metal. In embodiments, gaskets (97) are disposed between the compression plate (14a) and a surface of the baseplate (10) proximate the baseplate channel (12). In embodiments, a channel cap (26) is disposed over the open channel. In embodiments, the channel cap (26) has a solder flow channel (29, 32) provided in a surface thereof. In the embodiments, the solder flow channel (29, 32) has a meandering shape. In embodiments, a solder flow channel (29, 32?) is provided in the compression plate (14a) and/or the baseplate (10).
    Type: Application
    Filed: November 15, 2022
    Publication date: December 19, 2024
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Amanda HUBBARD, Brian LABOMBARD, Richard MURRAY, James IRBY, Rui VIEIRA, William BECK, Thomas TOLAND, Vincent FRY, Shane SCHWEIGER, Amelia WATTERSON, Sarah CHAMBERLAIN, Jose ESTRADA, Theodore MOURATIDIS, Kenneth STEVENS
  • Publication number: 20240203628
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: September 28, 2023
    Publication date: June 20, 2024
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLC
    Inventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Patent number: 11810712
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: November 7, 2023
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20230282400
    Abstract: A method includes inserting a high temperature superconductor (HTS) cable into a groove of a support structure; and flowing a molten metal into the HTS cable while the HTS cable is in the groove. A magnet structure includes a support structure having a groove; and a high temperature superconductor (HTS) cable comprising a metal at least partially filling the HTS cable, the HTS cable being disposed in the groove.
    Type: Application
    Filed: May 11, 2021
    Publication date: September 7, 2023
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Robert MUMGAARD
  • Publication number: 20230207171
    Abstract: Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.
    Type: Application
    Filed: March 25, 2021
    Publication date: June 29, 2023
    Applicant: Massachusetts Institute of Technology
    Inventors: Brian LABOMBARD, William BECK, Theodore MOURATIDIS
  • Publication number: 20230170119
    Abstract: Magnets and magnet systems include stacked magnet baseplates. Each of the plates includes grooves that contain windings of a conductor (e.g. a high temperature superconductor) that generates a magnetic field when current is passed through. This field generates Lorentz forces in the stack that press the conductors in different directions and with different magnitudes. Thus, the plates are oppositely oriented (mirrored) so that these forces always press the conductors into the grooves, rather than pulling them out of the grooves. The conductors may be further reinforced in their grooves with solder or epoxy potting. Some stacks may have more plates in one orientation than in the mirrored orientation, because the Lorentz forces need not be symmetrical with respect to a midpoint of the stack, e.g. when the system experiences externally-applied magnetic fields. Additional, mirrored side plates may be added in some configurations.
    Type: Application
    Filed: February 22, 2021
    Publication date: June 1, 2023
    Applicant: Massachusetts Institute of Technology
    Inventor: Brian LABOMBARD
  • Publication number: 20230146164
    Abstract: According to some aspects, techniques are described for designing non-insulated (NI) high temperature superconductor (HTS) magnets that mitigate problems that may arise during quench initiation and propagation. Coupling the HTS material to a co-conductor along its length reduces the effective resistance of the conductive path along the HTS material when it is not superconducting, and that this leads to numerous advantages for quench mitigation.
    Type: Application
    Filed: March 25, 2021
    Publication date: May 11, 2023
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LABOMBARD, Krishna Kiran Kumar UPPALAPATI
  • Publication number: 20230073419
    Abstract: Schemes are described for conductor and coolant placement in stacked-plate superconducting magnets, including arranging coolant channels and conducting channels within the plates on opposing faces. If the two types of channels are aligned with one another across the plate stacks, the plates may be stacked such that the cooling channel in one plate is adjacent to the conducting channel of the neighboring plate. By stacking a number of these plates, therefore, cooling may be supplied to each conducting channel through the cooling channels of each neighboring plate. Moreover, by aligning the two types of channels, the stacks of plates may have improved mechanical strength because mechanical load paths through the entire stack that do not pass through any of the channels may be created. This arrangement of channels may produce a very strong stack of plates that can withstand high Lorentz loads.
    Type: Application
    Filed: March 25, 2021
    Publication date: March 9, 2023
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian LABOMBARD, Robert MUMGAARD, William BECK, Jeffrey DOODY
  • Publication number: 20220336130
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLC
    Inventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
  • Patent number: 11417464
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: August 16, 2022
    Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20210313104
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: June 11, 2021
    Publication date: October 7, 2021
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Patent number: 11094439
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 17, 2021
    Assignee: Massachusetts Institute of Technology
    Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
  • Publication number: 20200402693
    Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.
    Type: Application
    Filed: December 23, 2019
    Publication date: December 24, 2020
    Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Daniel BRUNNER, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU