Abstract: There is provided a control system for controlling two or more illuminates of a multi-modality ophthalmic imaging system that are arranged to generate light for imaging an eye, the control system comprising: a processor which selects, from the illuminates and based on a selected imaging modality of the ophthalmic imaging system, one or more illuminates that are to be used to image the eye, and to generate an input signal identifying the selected one or more illuminates. The control system further comprises a logic block, which receives the input signal and comprises logic that determines a respective operating power for each illuminate of the selected one or more illuminates, based on the received input signal. The logic block also generates a respective control signal for each illuminate of the selected one or more illuminates, each control signal indicating the respective operating power determined for the respective illuminate.

Abstract: An image data file undergoes compression, such as JPEG compression. The size of the resulting compressed file is compared with a file size limit. If the file size limit is exceeded, then the compression factor may be increased. A scaler reduces the image pixel resolution if the required compression factor would otherwise exceed a predetermined limit. This may prevent a high degree of compression from providing an image of poor visual quality.

Abstract: An image data file undergoes compression, such as JPEG compression. The size of the resulting compressed file is compared with a file size limit. If the file size limit is exceeded, then the compression factor may be increased. A scaler reduces the image pixel resolution if the required compression factor would otherwise exceed a predetermined limit. This may prevent a high degree of compression from providing an image of poor visual quality.

Abstract: The data communication system includes a first control device, a second data device and a data link, including a first transmission link and a second transmission link, between the second data device and the first control device. A data driver enables data transmission from the second data device to the first control device across the data link, and a differential controller is adapted to generate a voltage differential between the first transmission link and the second transmission link. A detector detects differences in voltage levels between the first transmission link and the second transmission link. The data communication system enables bi-directional communication between integrated circuit devices over a serial communication link avoiding the necessity for clock, chip enable and control connections on the data device and is particularly useful for communication between an image sensor and coprocessor.

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.