Patents by Inventor Brian Lawrence Gilmore
Brian Lawrence Gilmore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8420554Abstract: A wafer support ring and a method of using the same are disclosed herein. The support ring supports a wafer during a first processing operation. A top surface of the support ring is in contact with a first plurality of locations on a surface of the wafer during the first processing operation. A second wafer support structure is used to support the wafer during a second processing operation. A top surface of the second wafer support structure is in contact with a second, different plurality of locations on the surface of the wafer during the second processing operation. The wafer support ring may also have an outer lip disposed about an outer periphery of the support ring that has a depth such that it does not form part of the top surface of the support ring.Type: GrantFiled: May 3, 2010Date of Patent: April 16, 2013Assignee: MEMC Electronic Materials, Inc.Inventor: Brian Lawrence Gilmore
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Patent number: 8220647Abstract: A wafer boat for a semiconductor wafer includes vertical rods, fingers supported by the vertical rods, and plates supported by the fingers. The plate has a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.Type: GrantFiled: September 14, 2011Date of Patent: July 17, 2012Assignee: MEMC Electronic Materials, Inc.Inventors: Brian Lawrence Gilmore, Lance G. Hellwig
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Patent number: 8220646Abstract: A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.Type: GrantFiled: September 14, 2011Date of Patent: July 17, 2012Assignee: MEMC Electronic Materials, Inc.Inventors: Brian Lawrence Gilmore, Lance G. Hellwig
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Patent number: 8153538Abstract: A process is disclosed for annealing a single crystal silicon wafer having a front surface and a back surface, and an oxide layer disposed on the front surface of the wafer extending over substantially all of the radial width. The process includes annealing the wafer in an annealing chamber having an atmosphere comprising oxygen. The process also includes maintaining a partial pressure of water above a predetermined value such that the wafer maintains the oxide layer through the annealing process. The annealed front surface is substantially free of boron and phosphorus.Type: GrantFiled: December 9, 2010Date of Patent: April 10, 2012Assignee: MEMC Electronic Materials, Inc.Inventors: Larry Wayne Shive, Brian Lawrence Gilmore
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Publication number: 20120074081Abstract: A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.Type: ApplicationFiled: September 14, 2011Publication date: March 29, 2012Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Brian Lawrence Gilmore, Lance G. Hellwig
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Publication number: 20120077138Abstract: A wafer boat for a semiconductor wafer includes vertical rods, fingers supported by the vertical rods, and plates supported by the fingers. The plate has a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.Type: ApplicationFiled: September 14, 2011Publication date: March 29, 2012Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Brian Lawrence Gilmore, Lance G. Hellwig
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Publication number: 20110269316Abstract: A wafer support ring and a method of using the same are disclosed herein. The support ring supports a wafer during a first processing operation. A top surface of the support ring is in contact with a first plurality of locations on a surface of the wafer during the first processing operation. A second wafer support structure is used to support the wafer during a second processing operation. A top surface of the second wafer support structure is in contact with a second, different plurality of locations on the surface of the wafer during the second processing operation. The wafer support ring may also have an outer lip disposed about an outer periphery of the support ring that has a depth such that it does not form part of the top surface of the support ring.Type: ApplicationFiled: May 3, 2010Publication date: November 3, 2011Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventor: Brian Lawrence Gilmore
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Patent number: 8042697Abstract: A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.Type: GrantFiled: June 30, 2008Date of Patent: October 25, 2011Assignee: MEMC Electronic Materials, Inc.Inventors: Brian Lawrence Gilmore, Lance G. Hellwig
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Patent number: 7888685Abstract: Processes for the purification of silicon carbide structures, including silicon carbide coated silicon carbide structures, are disclosed. The processes described can reduce the amount of iron contamination in a silicon carbide structure by 100 to 1000 times. After purification, the silicon carbide structures are suitable for use in high temperature silicon wafer processing.Type: GrantFiled: July 27, 2004Date of Patent: February 15, 2011Assignee: MEMC Electronic Materials, Inc.Inventors: Larry Wayne Shive, Brian Lawrence Gilmore
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Publication number: 20100098519Abstract: A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an inclined surface rising from a bottom of the recessed area. The inclined surface has an incline angle that is no more than about ten degrees.Type: ApplicationFiled: October 17, 2008Publication date: April 22, 2010Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Larry Wayne Shive, Brian Lawrence Gilmore, Timothy John Snyder
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Patent number: 7696103Abstract: Processes for the purification of silicon carbide structures, including silicon carbide coated silicon carbide structures, are disclosed. The processes described can reduce the amount of iron contamination in a silicon carbide structure by 100 to 1000 times. After purification, the silicon carbide structures are suitable for use in high temperature silicon wafer processing.Type: GrantFiled: May 30, 2007Date of Patent: April 13, 2010Assignee: MEMC Electronic Materials, Inc.Inventors: Larry Wayne Shive, Brian Lawrence Gilmore
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Publication number: 20090321372Abstract: A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.Type: ApplicationFiled: June 30, 2008Publication date: December 31, 2009Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Brian Lawrence Gilmore, Lance G. Hellwig