Patents by Inventor Brian Lee Yonker

Brian Lee Yonker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same
    Patent number: 12158783
    Abstract: In some embodiments an apparatus includes a housing that defines an interior. The apparatus includes a first circuit board that has multiple integrated circuits (ICs). The first circuit board is disposed within the interior of the housing. The apparatus includes a second circuit board that has multiple ICs. The second circuit board is also disposed within the interior of the housing. The apparatus further includes a first electromagnetic interference (EMI) shield disposed about an IC from the multiple ICs of the first circuit board and not disposed about remaining ICs from the multiple ICs of the first circuit board. The apparatus further includes a second EMI shield disposed about the first circuit board and not the second circuit board. The apparatus further includes a third EMI shield disposed about the first circuit board and the second circuit board.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: December 3, 2024
    Assignee: Management Services Group, Inc.
    Inventors: Thomas Scott Morgan, Brian Lee Yonker
  • Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same
    Patent number: 11687129
    Abstract: In some embodiments an apparatus includes a housing that defines an interior. The apparatus includes a first circuit board that has multiple integrated circuits (ICs). The first circuit board is disposed within the interior of the housing. The apparatus includes a second circuit board that has multiple ICs. The second circuit board is also disposed within the interior of the housing. The apparatus further includes a first electromagnetic interference (EMI) shield disposed about an IC from the multiple ICs of the first circuit board and not disposed about remaining ICs from the multiple ICs of the first circuit board. The apparatus further includes a second EMI shield disposed about the first circuit board and not the second circuit board. The apparatus further includes a third EMI shield disposed about the first circuit board and the second circuit board.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: June 27, 2023
    Assignee: Management Services Group, Inc.
    Inventors: Thomas Scott Morgan, Brian Lee Yonker
  • Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same
    Patent number: 11307622
    Abstract: In some embodiments an apparatus includes a housing that defines an interior. The apparatus includes a first circuit board that has multiple integrated circuits (ICs). The first circuit board is disposed within the interior of the housing. The apparatus includes a second circuit board that has multiple ICs. The second circuit board is also disposed within the interior of the housing. The apparatus further includes a first electromagnetic interference (EMI) shield disposed about an IC from the multiple ICs of the first circuit board and not disposed about remaining ICs from the multiple ICs of the first circuit board. The apparatus further includes a second EMI shield disposed about the first circuit board and not the second circuit board. The apparatus further includes a third EMI shield disposed about the first circuit board and the second circuit board.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: April 19, 2022
    Assignee: Management Services Group, Inc.
    Inventors: Thomas Scott Morgan, Brian Lee Yonker
  • Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same
    Patent number: 10775856
    Abstract: In some embodiments an apparatus includes a housing that defines an interior. The apparatus includes a first circuit board that has multiple integrated circuits (ICs). The first circuit board is disposed within the interior of the housing. The apparatus includes a second circuit board that has multiple ICs. The second circuit board is also disposed within the interior of the housing. The apparatus further includes a first electromagnetic interference (EMI) shield disposed about an IC from the multiple ICs of the first circuit board and not disposed about remaining ICs from the multiple ICs of the first circuit board. The apparatus further includes a second EMI shield disposed about the first circuit board and not the second circuit board. The apparatus further includes a third EMI shield disposed about the first circuit board and the second circuit board.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: September 15, 2020
    Assignee: Management Services Group, Inc.
    Inventors: Thomas Scott Morgan, Brian Lee Yonker