Patents by Inventor Brian Lemoff
Brian Lemoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7223924Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads.Type: GrantFiled: September 23, 2003Date of Patent: May 29, 2007Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Steven Rosenau, Mohammed Ershad Ali, Jonathan Simon, Brian Lemoff, Lisa Anne Windover
-
Patent number: 7174065Abstract: An optical switching fabric with an optical to electrical converter in the output plane. The optical switching fabric has an input plane with at least one input. The input plane provides at least a first optical signal (e.g., a first set of optical signals). The optical switching fabric has an output plane. The optical switching fabric has an interconnection mechanism for receiving the first set of optical signals and directing each received optical signal to a predetermined location in the output plane. The output plane has at least one optical to electrical converter (e.g., a plurality of optical to electrical converters) for receiving the directed optical signals and responsive thereto for generating a set of corresponding electronic output signals.Type: GrantFiled: March 21, 2002Date of Patent: February 6, 2007Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.Inventors: Jonathan Lacey, Julie Fouquet, Dale Schroeder, Brian Lemoff
-
Publication number: 20050152640Abstract: A parallel optics and wavelength division multiplexing package for multiplexing optical data signals for transmission, or for receiving and demultiplexing optical data signals. The package includes an array of diodes mounted on a parallel transmitter or receiver circuit for receiving electrical signals from the circuit and converting them into an array of corresponding light signals, or for receiving an array of light signals and converting them into an array of corresponding electrical signals. In a transmitter package, an optical multiplexer, located adjacent the array of diodes, receives the array of light signals and converts them into a set of corresponding parallel multiplexed light signals. In a receiver package, an optical demultiplexer, located adjacent the array of diodes, receives a set of parallel multiplexed light signals and converts them into the array of demultiplexed light signals.Type: ApplicationFiled: January 9, 2004Publication date: July 14, 2005Inventor: Brian Lemoff
-
Publication number: 20050061545Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads.Type: ApplicationFiled: September 23, 2003Publication date: March 24, 2005Inventors: Steven Rosenau, Mohammed Ali, Jonathan Simon, Brian Lemoff, Lisa Windover
-
Patent number: 6865321Abstract: The present invention involves the use of coupling fixtures that permit optical elements to be aligned with planar waveguides of planar lightwave circuits. In particular, alignment of the coupling fixtures typically does not require powering of the optical element yet provides a degree of alignment that is comparable to that obtained by active alignment techniques. The alignment process is accompanied by an assembly process that may be performed at relatively high temperatures. This typically makes it possible to use solder for attaching the optical element to the planar lightwave circuit while retaining alignment accuracy. This is advantageous since soldering typically is the preferred choice for assembling components, such as single-mode devices, that require a relatively high degree of alignment precision together with good mechanical rigidity.Type: GrantFiled: July 31, 2002Date of Patent: March 8, 2005Assignee: Agilent Technologies, Inc.Inventors: Richard Paul Tella, William Gong, Brian Lemoff
-
Publication number: 20050031289Abstract: A fiber ribbon includes a plurality of first segments of optical fibers that extend in a planar side-by-side arrangement having a first predetermined pitch. A fiber-fan-out including a plurality of second segments of the optical fibers extends in a diverging arrangement from the fiber ribbon. A fiber holder extends across the plurality of second segments of the optical fibers for maintaining a plurality of terminal portions of the second segments in a second predetermined pitch that is greater than the first predetermined pitch so that the terminal portions can each be optically coupled to a corresponding optical subassembly (OSA) of a plurality of OSAs arranged in a linear array. An alternate embodiment uses a second fiber holder in place of the fiber ribbon. The holders can be replaced with a common housing assembly spanning all but the terminal portions of the optical fibers.Type: ApplicationFiled: August 5, 2003Publication date: February 10, 2005Inventor: Brian Lemoff
-
Publication number: 20050012199Abstract: A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.Type: ApplicationFiled: July 18, 2003Publication date: January 20, 2005Inventors: Steven Rosenau, Mohammed Ali, Brian Lemoff, Lisa Windover
-
Patent number: 6819821Abstract: An optical switch has a plurality of input ports and a plurality of output ports. The optical switch features a fan-out fan-in architecture has a fan-out stage, a fan-in stage, and a coupling mechanism. The fan-out stage is coupled to the plurality of input ports and has a first orientation. The fan-in stage is coupled to the plurality of output ports and has a second orientation. The coupling mechanism optically couples the fan-out stage with the fan-in stage and maintains a predetermined relationship between the first orientation of the fan-out stage and the second orientation of the fan-in stage.Type: GrantFiled: March 26, 2002Date of Patent: November 16, 2004Assignee: Agilent Technologies, Inc.Inventors: Jonathan Lacey, Brian Lemoff, Julie Fouquet
-
Publication number: 20040022491Abstract: The present invention involves the use of coupling fixtures that permit optical elements to be aligned with planar waveguides of planar lightwave circuits. In particular, alignment of the coupling fixtures typically does not require powering of the optical element yet provides a degree of alignment that is comparable to that obtained by active alignment techniques. The alignment process is accompanied by an assembly process that may be performed at relatively high temperatures. This typically makes it possible to use solder for attaching the optical element to the planar lightwave circuit while retaining alignment accuracy. This is advantageous since soldering typically is the preferred choice for assembling components, such as single-mode devices, that require a relatively high degree of alignment precision together with good mechanical rigidity.Type: ApplicationFiled: July 31, 2002Publication date: February 5, 2004Inventors: Richard Paul Tella, William Gong, Brian Lemoff
-
Publication number: 20030185491Abstract: An optical switch has a plurality of input ports and a plurality of output ports. The optical switch features a fan-out fan-in architecture has a fan-out stage, a fan-in stage, and a coupling mechanism. The fan-out stage is coupled to the plurality of input ports and has a first orientation. The fan-in stage is coupled to the plurality of output ports and has a second orientation. The coupling mechanism optically couples the fan-out stage with the fan-in stage and maintains a predetermined relationship between the first orientation of the fan-in stage and the second orientation of the fan-in stage.Type: ApplicationFiled: March 26, 2002Publication date: October 2, 2003Inventors: Jonathan Lacey, Brian Lemoff, Julie Fouquet
-
Publication number: 20030179983Abstract: An optical switching fabric with an optical to electrical converter in the output plane. The optical switching fabric has an input plane with at least one input. The input plane provides at least a first optical signal (e.g., a first set of optical signals). The optical switching fabric has an output plane. The optical switching fabric has an interconnection mechanism for receiving the first set of optical signals and directing each received optical signal to a predetermined location in the output plane. The output plane has at least one optical to electrical converter (e.g., a plurality of optical to electrical converters) for receiving the directed optical signals and responsive thereto for generating a set of corresponding electronic output signals.Type: ApplicationFiled: March 21, 2002Publication date: September 25, 2003Inventors: Jonathan Lacey, Julie Fouquet, Dale Schroeder, Brian Lemoff
-
Publication number: 20030168226Abstract: A package for an optical assembly of a type that uses bulk optics in an optical path will require environmental protection from contaminants. It is common to construct a substantially hermetically sealed package to provide environmental protection for the optical assembly but such hermetically sealed packages are expensive to construct and are not completely reliable. Consequently, the present invention provides a package (48) for an optical assembly with the bulk optics encapsulated by a silicone encapsulant (54) and encased within an epoxy layer (50) and supported by a substrate base (52). The package (48) for the optical assembly thus provides the bulk optics with the required environmental protection from contaminants.Type: ApplicationFiled: March 11, 2002Publication date: September 11, 2003Applicant: Agilent Technologies, Inc.Inventors: Andrew McGhee, Daniel John Keeble, Fabio Pozzi, Brian Lemoff
-
Patent number: 6613980Abstract: A package for an optical assembly of a type that uses bulk optics in an optical path will require environmental protection from contaminants. It is common to construct a substantially hermetically sealed package to provide environmental protection for the optical assembly but such hermetically sealed packages are expensive to construct and are not completely reliable. Consequently, a package is provided for an optical assembly with the bulk optics encapsulated by a silicone encapsulant and encased within an epoxy layer and supported by a substrate base. The package for the optical assembly thus provides the bulk optics with the required environmental protection from contaminants.Type: GrantFiled: March 11, 2002Date of Patent: September 2, 2003Assignee: Agilent Technologies, Inc.Inventors: Andrew McGhee, Daniel John Keeble, Fabio Pozzi, Brian Lemoff