Patents by Inventor Brian Litke

Brian Litke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200131363
    Abstract: A method of manufacturing a polyurethane phase-change composition comprises forming a curable composition comprising a homogeneous mixture of an organic isocyanate, a polyol having a hydroxyl functionality of 1.5 to 5, and a phase-change material; and curing the curable composition to obtain a polyurethane phase-change composition, wherein the polyurethane phase-change composition has a transition temperature, determined by differential scanning calorimetry according to ASTM D3418, of 5 to 70° C.
    Type: Application
    Filed: October 1, 2019
    Publication date: April 30, 2020
    Inventors: Ming Wei, Brian Litke
  • Publication number: 20150174726
    Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.
    Type: Application
    Filed: March 5, 2015
    Publication date: June 25, 2015
    Applicant: ROGERS CORPORATION
    Inventors: Brian Litke, Michele K. Koss
  • Patent number: 9056382
    Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: June 16, 2015
    Assignee: Rogers Corporation
    Inventors: Brian Litke, Michele K. Koss
  • Publication number: 20110130077
    Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.
    Type: Application
    Filed: May 27, 2010
    Publication date: June 2, 2011
    Inventors: Brian Litke, Michele K. Koss
  • Publication number: 20050124777
    Abstract: Polyurethane prepolymers with reduced amount of unreacted monomeric hexamethylene 1,6-diisocyanate (HDI) are provided. Also provided are polyurethane elastomers obtained by mixing the polyurethane prepolymers having reduced amount of unreacted monomeric HDI with amine and/or hydroxy chain extenders and durable, resilient, colorfast golf ball covers obtained therefrom. Rolls, wheels and tires obtained from the polyurethane elastomers are also provided.
    Type: Application
    Filed: January 17, 2005
    Publication date: June 9, 2005
    Inventors: Ronald Rosenberg, Zhenya Zhu, Glen Proctor, Brian Litke