Patents by Inventor Brian Littell

Brian Littell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket having heat-dissipating vents
    Patent number: 8425237
    Abstract: A socket receptive to insertion of an integrated circuit (IC) printed circuit board (PCB) includes a housing, conductors, and vents. The housing has first and second sides corresponding to a length of the IC PCB. The conductors are mounted within the housing to mate with corresponding conductors of the IC PCB upon insertion of the IC PCB into the housing, and have leads adapted to being soldered to corresponding conductors of a host PCB. The vents are within the housing and are adapted to dissipate heat resulting from soldering the leads to the host PCB to minimize warping of the housing during soldering. The vents are further adapted to compensate for a mismatch between a coefficient of thermal expansion (CTE) of the housing and a CTE of the host PCB during soldering, regardless of the CTE of the host PCB.
    Type: Grant
    Filed: September 11, 2010
    Date of Patent: April 23, 2013
    Assignee: International Business Machines Corporation
    Inventors: Tony C. Sass, Brian Littell
  • Socket having heat-dissipating vents
    Publication number: 20120064737
    Abstract: A socket receptive to insertion of an integrated circuit (IC) printed circuit board (PCB) includes a housing, conductors, and vents. The housing has first and second sides corresponding to a length of the IC PCB. The conductors are mounted within the housing to mate with corresponding conductors of the IC PCB upon insertion of the IC PCB into the housing, and have leads adapted to being soldered to corresponding conductors of a host PCB. The vents are within the housing and are adapted to dissipate heat resulting from soldering the leads to the host PCB to minimize warping of the housing during soldering. The vents are further adapted to compensate for a mismatch between a coefficient of thermal expansion (CTE) of the housing and a CTE of the host PCB during soldering, regardless of the CTE of the host PCB.
    Type: Application
    Filed: September 11, 2010
    Publication date: March 15, 2012
    Inventors: Tony C. Sass, Brian Littell