Abstract: A soldering apparatus for selectively soldering designated areas on the surface of a printed circuit (PC) board for mounting multi-pin, through hole circuit components thereto includes a wave solder pot, a fixture for receiving and positioning the PC board over the solder pot, and a plurality of spaced nozzles disposed adjacent a lower surface, i.e., solder side, of the PC board. When actuated, the apparatus directs a solder flow through the nozzles to designated areas corresponding to the location of various components on the PC board. Each nozzle is configured and positioned to match the location and pin pattern of components to be soldered on the PC board for applying solder only to the local area, not affecting adjacent parts, and minimizing the amount of solder applied as well as limiting the temperatures to which the PC board is subjected. The apparatus may be used with either a foam or wave flux application to selected areas of the PC board.