Patents by Inventor Brian Loy

Brian Loy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240023549
    Abstract: This disclosure relates to aryl amidines of Formula I and their use as fungicides.
    Type: Application
    Filed: November 22, 2021
    Publication date: January 25, 2024
    Applicant: CORTEVA AGRISCIENCE LLC
    Inventors: ANN BUYSSE, ERIN HANCOCK, SUSANA LOPEZ, BRIAN LOY, STACY T. MEYER, JEFF PETKUS, ADRIAN TLAHUEXT-ACA, WEIWEI WANG, PULAN YU
  • Publication number: 20240000075
    Abstract: This disclosure relates to aryl amidines of Formula I and their use as fungicides.
    Type: Application
    Filed: November 22, 2021
    Publication date: January 4, 2024
    Applicant: CORTEVA AGRISCIENCE LLC
    Inventors: CRUZ AVILA-ADAME, VASUDEV R. BHONDE, SUSANA LOPEZ, BRIAN LOY, STACY T. MEYER, ALEX NOLAN, ADRIAN TLAHUEXT-ACA
  • Publication number: 20080069856
    Abstract: A process for making an implantable material comprising a composite of a biocompatible polymer and a bioactive agent. The composite combines desirable mechanical properties of polymers and the bioactivity of tissue or one or more component of tissue. More particularly, but not exclusively, the invention relates to methods for the manufacture of implantable materials, devices and components via a powder molding process.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 20, 2008
    Inventors: SuPing Lyu, Christopher M. Hobot, Sean M. Haddock, Brian Loy, Randall V. Sparer, K. Matthew Kinnane, Jeffrey M. Gross
  • Publication number: 20060216321
    Abstract: An improved osteoimplant device and method for producing it. Bone particles are mixed with a polymer and a solvent. The mixture is formed into the shape of an osteoimplant and substantially all of the solvent is removed. The osteoimplant may be osteoinductive, osteoconductive, and load-bearing.
    Type: Application
    Filed: March 24, 2005
    Publication date: September 28, 2006
    Inventors: Suping Lyu, Jeff Gross, Sean Haddock, Chris Hobot, Matt Kinnane, Brian Loy, Jim Schley