Abstract: A biological sample processing apparatus having an enclosure and a plurality of sample processing modules held within an enclosure with a tiltable graphical user interface screen. In one aspect, the individual modules that are readily removable for repair, replacement or upgrade. Each module is configured to be independently operable and readily inserted into the enclosure for connection with a processing unit of the enclosure. Each module can include quick-release mechanisms so that the module can be readily removed and replaced manually or with minimal tools through the front of the enclosure without requiring substantial or total disassembly of the module or entire enclosure. In another aspect, the user interface screen can display identifying information, such as a barcode, that can be scanned by a user's portable device so as to monitor the progress of an assay remotely.

Abstract: A position determination system comprises a first measuring apparatus and a second measuring apparatus. The first measuring apparatus includes a first sensing device having a sensing field for obtaining positional data of a first testing target, a calibration target rigidly linked to the first sensing device, wherein the positional relationship between the first sensing device and the calibration target is known. The system has a repositioning mechanism for repositioning the sensing field of the first sensing device. The second measuring apparatus includes a second sensing device having a sensing field for obtaining positional data of a second testing target, a calibration sensing device rigidly linked to the second sensing device for obtaining positional data of the calibration target, wherein the positional relationship between the second sensing device and the calibration sensing device is known, and a repositioning mechanism for repositioning the sensing field of the second sensing device.

Abstract: An edge roller assembly includes first and second grip rings. The grip rings are held together in an opposing relationship such that outer surfaces thereof define a groove for receiving an edge of a substrate. The grip rings may be O-rings formed of a rubber material. In one embodiment, the grip rings are held together by lower and upper clamp plates that are adjustably fastened together so that the clamping forces exerted on the substrate can be controlled. The upper clamp plate may have a height adjustment knob for adjusting the height of the edge roller assembly mounted thereon. A method for contacting an edge of a substrate and a transport system for transporting semiconductor wafers to a wafer processing station also are described.

Abstract: Techniques are disclosed for providing a system that has a plurality of devices in which the position of a device of the plurality of devices relative to another device of the plurality of devices is self-calibrated. In one embodiment, the system is a five-camera aligner for use in aligning motor vehicle wheels. In this embodiment, the aligner includes a first camera pod having two alignment cameras and a calibration camera, and a second camera pod having another two alignment cameras and a calibration target. Because the aligner has four alignment cameras and a calibration camera, the aligner is often referred to as a five-camera aligner. For illustration purposes, the first camera pod is herein referred to as the left camera pod and the second camera pod is herein referred to as the right camera pod. In one embodiment, the left camera pod is placed to the left of the aligner, and the right camera pod is placed to the right of the aligner.

Abstract: A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.

Abstract: A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.

Abstract: A brush core and method of making a brush core are provided. The brush core is configured to be implemented in substrate preparation systems. The brush core is connected between a first end and a second end of a non-rotating shaft. A motor is contained within the brush core for rotating the brush core around the non-rotating shaft. The first end and the second end are each capable of being adjusted to calibrate and position the brush core. The calibrated position of the brush core can be set to compensate for a skewed substrate, or to achieve a desired pressure application profile over the substrate.

Abstract: In a method for controlling airflow on a backside of a semiconductor wafer during spin processing, a wafer backing plate is first disposed below a semiconductor wafer. Air is then supplied to the volume defined by the wafer backing plate and the semiconductor wafer. The air may be supplied to the volume through a hollow core spindle, a rotary union, or apertures in the wafer backing plate. The separation distance between the wafer and the wafer backing plate and the flow rate of air supplied to the volume may be controlled to avoid any substantial recirculation of contaminated air into the volume. In addition to serving as one of the boundaries that define the volume, the wafer backing plate reduces particle recontamination on the backside of the wafer by preventing particles from contacting the backside of the wafer during spin processing.

Abstract: A position determination system comprises a first measuring apparatus and a second measuring apparatus. The first measuring apparatus includes a first sensing device having a sensing field for obtaining positional data of a first testing target, a calibration target rigidly linked to the first sensing device, wherein the positional relationship between the first sensing device and the calibration target is known. The system has a repositioning mechanism for repositioning the sensing field of the first sensing device. The second measuring apparatus includes a second sensing device having a sensing field for obtaining positional data of a second testing target, a calibration sensing device rigidly linked to the second sensing device for obtaining positional data of the calibration target, wherein the positional relationship between the second sensing device and the calibration sensing device is known, and a repositioning mechanism for repositioning the sensing field of the second sensing device.

Abstract: A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.

Abstract: A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.

Abstract: In a method for controlling airflow on a backside of a semiconductor wafer during spin processing, a wafer backing plate is first disposed below a semiconductor wafer. Air is then supplied to the volume defined by the wafer backing plate and the semiconductor wafer. The air may be supplied to the volume through a hollow core spindle, a rotary union, or apertures in the wafer backing plate. The separation distance between the wafer and the wafer backing plate and the flow rate of air supplied to the volume may be controlled to avoid any substantial recirculation of contaminated air into the volume. In addition to serving as one of the boundaries that define the volume, the wafer backing plate reduces particle recontamination on the backside of the wafer by preventing particles from contacting the backside of the wafer during spin processing.

Abstract: A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.

Abstract: A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.

Abstract: Techniques are disclosed for providing a system that has a plurality of devices in which the position of a device of the plurality of devices relative to another device of the plurality of devices is self-calibrated. In one embodiment, the system is a five-camera aligner for use in aligning motor vehicle wheels. In this embodiment, the aligner includes a first camera pod having two alignment cameras and a calibration camera, and a second camera pod having another two alignment cameras and a calibration target. Because the aligner has four alignment cameras and a calibration camera, the aligner is often referred to as a five-camera aligner. For illustration purposes, the first camera pod is herein referred to as the left camera pod and the second camera pod is herein referred to as the right camera pod. In one embodiment, the left camera pod is placed to the left of the aligner, and the right camera pod is placed to the right of the aligner.